Embedded - System On Chip (SoC)
873 Products Found Manufacturers: Microchip
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Microchip(868)
Package
Series
Mfr
Product Status
Package / Case
Number of I/Os
Operating Temperature
Peripherals
Supplier Device Package
Connectivity
Core Processor
Speed
Architecture
Primary Attributes
RAM Size
Flash Size
Program Memory Size
Maximum Clock Frequency
Data RAM Size
| Part # | Manufacturer | Pricing | Quantity | Availability | Package / Case | Supplier Device Package | Base Product Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of I/Os | Number of Logic Elements | Package | Product Status | Operating Temperature | Series | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Speed Grade | Primary Attributes | Flash Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Microchip | Min.: 1 Mult.: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 372 | - | Tray | Active | - | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 254K Logic Modules | 128kB | |||
| Microchip | Min.: 1 Mult.: 1 | 784-FBGA | 784-VFBGA (23x23) | - | + 85 C | Microchip Technology | 0 C | SMD/SMT | - | 56500 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | - | |||
| Microchip | Min.: 1 Mult.: 1 | 784-FBGA | 784-VFBGA (23x23) | - | - | Microchip Technology | - | - | - | - | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | - | |||
| Microchip | Min.: 1 Mult.: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500 | - | Microchip Technology | - | - | MCU - 22, FPGA - 66 | - | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||
| Microchip | Min.: 1 Mult.: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 312 | - | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 161K Logic Modules | 128KB | |||
| Microchip | Min.: 1 Mult.: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | - | Microchip Technology | - | - | MCU - 25, FPGA - 66 | - | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||
| Microchip | Min.: 1 Mult.: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 372 | - | Tray | Active | - | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 254K Logic Modules | 128kB | |||
| Microchip | Min.: 1 Mult.: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | - | Microchip Technology | - | - | MCU - 25, FPGA - 66 | - | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||
| Microchip | Min.: 1 Mult.: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 372 | - | Tray | Active | - | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 254K Logic Modules | 128kB | |||
| Microchip | Min.: 1 Mult.: 1 | 536-LFBGA | 536-BGA (16x16) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 168 | - | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 161K Logic Modules | 128KB | |||
| Microchip | Min.: 1 Mult.: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 372 | - | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 254K Logic Modules | 128KB | |||
| Microchip | Min.: 1 Mult.: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | - | Microchip Technology | - | - | MCU - 25, FPGA - 66 | - | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||
| Microchip | Min.: 1 Mult.: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | - | - | Microchip Technology | - | - | MCU - 136, FPGA - 468 | - | Tray | Active | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | - | FPGA - 461K Logic Modules | 128kB | |||
