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Mfr. Part # 10AS027E4F29I3SG

10AS032E4F29I3LG

Manufacturer ALTERAALTERA
Description

780-PIN FBGA

780-PIN FBGA

Datasheet
RoHS
Specifications

Package / Case

FBGA-780

FBGA-780

Number of Pins

16

-

RoHS

Non-Compliant

Details

Number of I/Os

360

360

Moisture Sensitive

Yes

Yes

Shipping Restrictions

This product may require additional documentation to export from the United States.

This product may require additional documentation to export from the United States.

L1 Cache Instruction Memory

2 x 32 kB

2 x 32 kB

Maximum Clock Frequency

1.2 GHz

1.2 GHz

Number of Logic Elements

270000 LE

320000 LE

Factory Pack QuantityFactory Pack Quantity

1

1

Mounting Styles

SMD/SMT

SMD/SMT

Number of Logic Array Blocks - LABs

33750 LAB

40000 LAB

Part # Aliases

965265

964847

Manufacturer

Intel

Intel

Brand

Intel / Altera

Intel / Altera

Tradename

Arria 10 SoC

Arria 10 SoC

L1 Cache Data Memory

2 x 32 kB

2 x 32 kB

Data RAM Size

-

-

Operating Temperature

-40°C ~ 100°C (TJ)

-65°C ~ 175°C

Series

Arria 10 SX

806

Packaging

Tray

Tray

Part Status

Active

Active

Subcategory

SOC - Systems on a Chip

SOC - Systems on a Chip

Speed

1.5GHz

1.5GHz

RAM Size

256KB

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

DMA, POR, WDT

Program Memory Size

-

-

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

MCU, FPGA

Product Type

SoC FPGA

SoC FPGA

Primary Attributes

FPGA - 270K Logic Elements

FPGA - 320K Logic Elements

Number of Cores

2 Core

2 Core

Flash Size

--

--

Product Category

SoC FPGA

SoC FPGA

Mounting Type

-

Panel Mount, Through Hole

Surface Mount

-

YES

Mounting Feature

-

Flange

Shell Material

-

Stainless Steel

Number of Terminals

-

780

Package

-

Retail Package

Primary Material

-

Metal

Mfr

-

Glenair

Product Status

-

Active

Contact Materials

-

Copper Alloy

Contact Finish Mating

-

Gold

Package Description

-

BGA, BGA780,28X28,40

Package Style

-

GRID ARRAY

Package Body Material

-

PLASTIC/EPOXY

Package Equivalence Code

-

BGA780,28X28,40

Operating Temperature-Min

-

-40 °C

Supply Voltage-Nom

-

0.9 V

Reflow Temperature-Max (s)

-

NOT SPECIFIED

Supply Voltage-Min

-

0.87 V

Operating Temperature-Max

-

100 °C

Rohs Code

-

Yes

Manufacturer Part Number

-

10AS032E4F29I3LG

Package Code

-

BGA

Package Shape

-

SQUARE

Part Life Cycle Code

-

Active

Ihs Manufacturer

-

INTEL CORP

Supply Voltage-Max

-

0.93 V

Risk Rank

-

5.45

Termination

-

Solder

Connector Type

-

Plug, Male Pins

Color

-

Silver

HTS Code

-

8542.39.00.01

Fastening Type

-

Threaded

Technology

-

CMOS

Terminal Position

-

BOTTOM

Orientation

-

F

Terminal Form

-

BALL

Peak Reflow Temperature (Cel)

-

NOT SPECIFIED

Terminal Pitch

-

1 mm

Reach Compliance Code

-

compliant

Shell Finish

-

Passivated

Shell Size - Insert

-

26-20A

JESD-30 Code

-

S-PBGA-B780

Number of Outputs

-

360

Qualification Status

-

Not Qualified

Power Supplies

-

0.9 V

Temperature Grade

-

INDUSTRIAL

Number of Inputs

-

360

Seated Height-Max

-

3.35 mm

Programmable Logic Type

-

FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Cells

-

320000

Width

-

29 mm

Length

-

29 mm

Pricing(USD)
Grads Price

Quantity

Unit Price

1+

$1343.54084

10+

$1299.36252

25+

$1290.3302

50+

$1281.36068

100+

$1255.00556

500+

$1165.27907

Quantity

Unit Price

1+

$2033.39214

10+

$1966.53012

25+

$1952.8601

50+

$1939.2851

100+

$1899.39775

500+

$1763.60051

Availability

877

782

Price

$1343.54084

$2033.39214

Quantity

In Stock : 877