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Mfr. Part # 10AS032H2F34E1SG

10AS048K2F35E1SG

Manufacturer ALTERAALTERA
Description

IC SOC FPGA 384 I/O 1152FBGA

IC SOC FPGA 396 I/O 1152FBGA

Datasheet
RoHS
Specifications

Package / Case

1152-BBGA, FCBGA

1152-BBGA, FCBGA

Surface Mount

YES

YES

Supplier Device Package

1152-FBGA (35x35)

1152-FBGA (35x35)

Number of Terminals

1152

1152

Package

Bulk

Bag

Base Product Number

YAFD54

-

Mfr

TE Connectivity Deutsch Connectors

Hirose Electric Co Ltd

Product Status

Active

Last Time Buy

Number of I/Os

384

396

Package Description

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

Package Style

GRID ARRAY

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

PLASTIC/EPOXY

Package Equivalence Code

BGA1152,34X34,40

BGA1152,34X34,40

Supply Voltage-Nom

0.9 V

0.9 V

Reflow Temperature-Max (s)

NOT SPECIFIED

NOT SPECIFIED

Supply Voltage-Min

0.87 V

0.87 V

Operating Temperature-Max

100 °C

100 °C

Rohs Code

Yes

Yes

Manufacturer Part Number

10AS032H2F34E1SG

10AS048K2F35E1SG

Package Code

BGA

BGA

Package Shape

SQUARE

SQUARE

Manufacturer

Intel Corporation

Intel Corporation

Part Life Cycle Code

Obsolete

Obsolete

Ihs Manufacturer

INTEL CORP

INTEL CORP

Supply Voltage-Max

0.93 V

0.93 V

Risk Rank

5.66

5.68

Series

*

MF25

Operating Temperature

0°C ~ 100°C (TJ)

-40°C ~ 75°C

Packaging

Tray

Tray

Part Status

Discontinued at Digi-Key

Discontinued at Digi-Key

HTS Code

8542.39.00.01

8542.39.00.01

Subcategory

Field Programmable Gate Arrays

Field Programmable Gate Arrays

Technology

CMOS

CMOS

Terminal Position

BOTTOM

BOTTOM

Terminal Form

BALL

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

NOT SPECIFIED

Terminal Pitch

1 mm

1 mm

Reach Compliance Code

compliant

compliant

JESD-30 Code

S-PBGA-B1152

S-PBGA-B1152

Number of Outputs

384

396

Qualification Status

Not Qualified

Not Qualified

Power Supplies

0.9 V

0.9 V

Temperature Grade

OTHER

OTHER

Speed

1.5GHz

1.5GHz

RAM Size

256KB

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

MCU, FPGA

Number of Inputs

384

396

Seated Height-Max

3.65 mm

3.5 mm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 320K Logic Elements

FPGA - 480K Logic Elements

Number of Logic Cells

320000

480000

Flash Size

--

--

Width

35 mm

35 mm

Length

35 mm

35 mm

Mounting Type

-

Free Hanging (In-Line)

Mounting Feature

-

-

Shell Material

-

Aluminum Die Cast, Brass

Insert Material

-

Synthetic Resin

Backshell Material, Plating

-

-

Voltage, Rating

-

300VAC, 420VDC

Primary Material

-

Metal

Contact Materials

-

Brass

Contact Finish Mating

-

Silver

Termination

-

Solder Cup

Connector Type

-

Plug, Female Sockets

Number of Positions

-

5 (3 + 2 Fiber Optic)

Color

-

Black

Applications

-

Transportation

Fastening Type

-

Threaded

Current Rating (Amps)

-

30A

Orientation

-

Keyed

Shielding

-

Unshielded

Ingress Protection

-

IP67 - Dust Tight, Waterproof

Shell Finish

-

Black Chrome

Shell Size - Insert

-

-

Shell Size, MIL

-

-

Cable Opening

-

-

Features

-

Backshell, Cable Clamp, Coupling Nut

Contact Finish Thickness - Mating

-

-

Material Flammability Rating

-

UL94 V-0

Pricing(USD)
Grads Price
-
-
Availability

-

-

Price

-

-

Quantity

In Stock