| Mfr. Part # | 10AS032H4F34I3LG | 10AS027H3F34E2LG |
| Manufacturer | ALTERA | ALTERA |
| Description | 1152-PIN FBGA | 1152-PIN FBGA |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Package / Case | FBGA-1152 | FBGA-1152 |
Surface Mount | YES | YES |
Number of Terminals | 1152 | 1152 |
Package | Box | - |
Base Product Number | MAX147 | - |
Mfr | Analog Devices Inc./Maxim Integrated | - |
Product Status | Obsolete | - |
Number of I/Os | 384 | 384 |
Moisture Sensitive | Yes | Yes |
Shipping Restrictions | This product may require additional documentation to export from the United States. | This product may require additional documentation to export from the United States. |
L1 Cache Instruction Memory | 2 x 32 kB | 2 x 32 kB |
Maximum Clock Frequency | 1.2 GHz | 1.2 GHz |
Number of Logic Elements | 320000 LE | 270000 LE |
Factory Pack QuantityFactory Pack Quantity | 1 | 1 |
Mounting Styles | SMD/SMT | SMD/SMT |
Number of Logic Array Blocks - LABs | 40000 LAB | 33750 LAB |
Part # Aliases | 965347 | 965284 |
Manufacturer | Intel | Intel |
Brand | Intel / Altera | Intel / Altera |
Tradename | Arria 10 SoC | Arria 10 SoC |
RoHS | Details | Details |
L1 Cache Data Memory | 2 x 32 kB | 2 x 32 kB |
Data RAM Size | - | - |
Package Description | BGA, BGA1152,34X34,40 | BGA, BGA1152,34X34,40 |
Package Style | GRID ARRAY | GRID ARRAY |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Equivalence Code | BGA1152,34X34,40 | BGA1152,34X34,40 |
Operating Temperature-Min | -40 °C | - |
Supply Voltage-Nom | 0.9 V | 0.9 V |
Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED |
Supply Voltage-Min | 0.87 V | 0.87 V |
Operating Temperature-Max | 100 °C | 100 °C |
Rohs Code | Yes | Yes |
Manufacturer Part Number | 10AS032H4F34I3LG | 10AS027H3F34E2LG |
Package Code | BGA | BGA |
Package Shape | SQUARE | SQUARE |
Part Life Cycle Code | Active | Active |
Ihs Manufacturer | INTEL CORP | INTEL CORP |
Supply Voltage-Max | 0.93 V | 0.93 V |
Risk Rank | 5.45 | 5.43 |
Series | - | Arria 10 SX |
Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Packaging | Tray | Tray |
Part Status | Active | Active |
Type | Power Management | - |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Subcategory | SOC - Systems on a Chip | SOC - Systems on a Chip |
Technology | CMOS | CMOS |
Terminal Position | BOTTOM | BOTTOM |
Terminal Form | BALL | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED |
Terminal Pitch | 1 mm | 1 mm |
Reach Compliance Code | compliant | compliant |
JESD-30 Code | S-PBGA-B1152 | S-PBGA-B1152 |
Function | Battery Charger | - |
Number of Outputs | 384 | 384 |
Qualification Status | Not Qualified | Not Qualified |
Power Supplies | 0.9 V | 0.9 V |
Temperature Grade | INDUSTRIAL | OTHER |
Speed | 1.5GHz | 1.5GHz |
RAM Size | 256KB | 256KB |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals | DMA, POR, WDT | DMA, POR, WDT |
Program Memory Size | - | - |
Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA | MCU, FPGA |
Number of Inputs | 384 | 384 |
Seated Height-Max | 3.65 mm | 3.65 mm |
Utilized IC / Part | MAX14750 | - |
Supplied Contents | Board(s) | - |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Product Type | SoC FPGA | SoC FPGA |
Primary Attributes | - | FPGA - 270K Logic Elements |
Embedded | - | - |
Secondary Attributes | - | - |
Number of Logic Cells | 320000 | 270000 |
Number of Cores | 2 Core | 2 Core |
Flash Size | -- | -- |
Product Category | SoC FPGA | SoC FPGA |
Width | 35 mm | 35 mm |
Length | 35 mm | 35 mm |
Material | - | Stainless Steel |
| Pricing(USD) | ||
| Grads Price | - | Quantity Unit Price 1+ $1994.92258 10+ $1929.32551 25+ $1915.91411 50+ $1902.59594 100+ $1863.46321 500+ $1730.23511 |
| Availability | - | 836 |
| Price | - | $1994.92258 |
| Quantity |
In Stock
