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HomeAll CategoryComparison10as048k2f35e1sg_46245993-vs-10as066k4f35i3sges_40541071

Comparison

10AS048K2F35E1SG vs 10AS066K4F35I3SGES
Mfr. Part # 10AS048K2F35E1SG

10AS066K4F35I3SGES

Manufacturer ALTERAALTERA
Description

IC SOC FPGA 396 I/O 1152FBGA

IC SOC FPGA 396 I/O 1152FBGA

Datasheet
RoHS
Specifications

Mounting Type

Free Hanging (In-Line)

-

Package / Case

1152-BBGA, FCBGA

1152-BBGA, FCBGA

Surface Mount

YES

YES

Mounting Feature

-

-

Shell Material

Aluminum Die Cast, Brass

-

Supplier Device Package

1152-FBGA (35x35)

1152-FBGA (35x35)

Insert Material

Synthetic Resin

-

Number of Terminals

1152

1152

Backshell Material, Plating

-

-

Voltage, Rating

300VAC, 420VDC

-

Package

Bag

Tape & Reel (TR)

Primary Material

Metal

-

Mfr

Hirose Electric Co Ltd

Knowles Syfer

Product Status

Last Time Buy

Active

Contact Materials

Brass

-

Contact Finish Mating

Silver

-

Number of I/Os

396

396

Package Description

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

BGA,

Package Style

GRID ARRAY

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

PLASTIC/EPOXY

Package Equivalence Code

BGA1152,34X34,40

-

Supply Voltage-Nom

0.9 V

0.9 V

Reflow Temperature-Max (s)

NOT SPECIFIED

-

Supply Voltage-Min

0.87 V

0.87 V

Operating Temperature-Max

100 °C

100 °C

Rohs Code

Yes

-

Manufacturer Part Number

10AS048K2F35E1SG

10AS066K4F35I3SGES

Package Code

BGA

BGA

Package Shape

SQUARE

SQUARE

Manufacturer

Intel Corporation

Intel Corporation

Part Life Cycle Code

Obsolete

Obsolete

Ihs Manufacturer

INTEL CORP

INTEL CORP

Supply Voltage-Max

0.93 V

0.93 V

Risk Rank

5.68

5.66

Operating Temperature

-40°C ~ 75°C

-40°C ~ 100°C (TJ)

Series

MF25

*

Packaging

Tray

Tray

Part Status

Discontinued at Digi-Key

Discontinued at Digi-Key

Termination

Solder Cup

-

Connector Type

Plug, Female Sockets

-

Number of Positions

5 (3 + 2 Fiber Optic)

-

Color

Black

-

Applications

Transportation

-

HTS Code

8542.39.00.01

8542.39.00.01

Fastening Type

Threaded

-

Subcategory

Field Programmable Gate Arrays

-

Current Rating (Amps)

30A

-

Technology

CMOS

-

Terminal Position

BOTTOM

BOTTOM

Orientation

Keyed

-

Terminal Form

BALL

BALL

Shielding

Unshielded

-

Peak Reflow Temperature (Cel)

NOT SPECIFIED

-

Ingress Protection

IP67 - Dust Tight, Waterproof

-

Terminal Pitch

1 mm

1 mm

Reach Compliance Code

compliant

compliant

Shell Finish

Black Chrome

-

Shell Size - Insert

-

-

JESD-30 Code

S-PBGA-B1152

S-PBGA-B1152

Number of Outputs

396

-

Qualification Status

Not Qualified

-

Power Supplies

0.9 V

-

Temperature Grade

OTHER

INDUSTRIAL

Speed

1.5GHz

1.5GHz

RAM Size

256KB

256KB

Shell Size, MIL

-

-

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Cable Opening

-

-

Architecture

MCU, FPGA

MCU, FPGA

Number of Inputs

396

-

Seated Height-Max

3.5 mm

3.5 mm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 480K Logic Elements

FPGA - 660K Logic Elements

Number of Logic Cells

480000

-

Flash Size

--

--

Features

Backshell, Cable Clamp, Coupling Nut

-

Width

35 mm

35 mm

Length

35 mm

35 mm

Contact Finish Thickness - Mating

-

-

Material Flammability Rating

UL94 V-0

-

Operating Temperature-Min

-

-40 °C

Pricing(USD)
Grads Price
-
-
Availability

-

-

Price

-

-

Quantity

In Stock