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HomeAll CategoryComparison10as066h4f34i3sges_46027014-vs-10as048k2f35e1sg_46245993

Comparison

10AS066H4F34I3SGES vs 10AS048K2F35E1SG
Mfr. Part # 10AS066H4F34I3SGES

10AS048K2F35E1SG

Manufacturer ALTERAALTERA
Description

IC SOC FPGA 492 I/O 1152FBGA

IC SOC FPGA 396 I/O 1152FBGA

Datasheet
RoHS
Specifications

Package / Case

1152-BBGA, FCBGA

1152-BBGA, FCBGA

Surface Mount

YES

YES

Supplier Device Package

1152-FCBGA (35x35)

1152-FBGA (35x35)

Number of Terminals

1152

1152

1st Connector Mounting Type

-

-

2nd Connector Mounting Type

-

-

1st Contact Gender

Male

-

Package

Bulk

Bag

Base Product Number

CASNM48

-

Mfr

TE Connectivity Laird

Hirose Electric Co Ltd

1st Connector Mounting Feature

-

-

Product Status

Active

Last Time Buy

2nd Contact Gender

-

-

2nd Connector Mounting Feature

-

-

Cable Types

-

-

Number of I/Os

492

396

Package Description

BGA,

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

Package Style

GRID ARRAY

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

-

Supply Voltage-Nom

0.9 V

0.9 V

Supply Voltage-Min

0.87 V

0.87 V

Operating Temperature-Max

100 °C

100 °C

Manufacturer Part Number

10AS066H4F34I3SGES

10AS048K2F35E1SG

Package Code

BGA

BGA

Package Shape

SQUARE

SQUARE

Manufacturer

Intel Corporation

Intel Corporation

Part Life Cycle Code

Obsolete

Obsolete

Ihs Manufacturer

INTEL CORP

INTEL CORP

Supply Voltage-Max

0.93 V

0.93 V

Risk Rank

5.66

5.68

Operating Temperature

-

-40°C ~ 75°C

Series

-

MF25

Packaging

Tray

Tray

Part Status

Discontinued at Digi-Key

Discontinued at Digi-Key

Color

-

Black

HTS Code

8542.39.00.01

8542.39.00.01

Terminal Position

BOTTOM

BOTTOM

Terminal Form

BALL

BALL

Ingress Protection

-

IP67 - Dust Tight, Waterproof

Terminal Pitch

1 mm

1 mm

Style

RP-BNC to N-Type

-

Reach Compliance Code

compliant

compliant

JESD-30 Code

S-PBGA-B1152

S-PBGA-B1152

Temperature Grade

INDUSTRIAL

OTHER

Speed

1.5GHz

1.5GHz

RAM Size

256KB

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

MCU, FPGA

Seated Height-Max

3.65 mm

3.5 mm

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

FIELD PROGRAMMABLE GATE ARRAY

1st Connector

N-Type Plug

-

2nd Connector

-

-

Primary Attributes

FPGA - 660K Logic Elements

FPGA - 480K Logic Elements

Flash Size

--

--

Features

-

Backshell, Cable Clamp, Coupling Nut

Length

48.0 (1.2m) 4.0

35 mm

Width

35 mm

35 mm

Mounting Type

-

Free Hanging (In-Line)

Mounting Feature

-

-

Shell Material

-

Aluminum Die Cast, Brass

Insert Material

-

Synthetic Resin

Backshell Material, Plating

-

-

Voltage, Rating

-

300VAC, 420VDC

Primary Material

-

Metal

Contact Materials

-

Brass

Contact Finish Mating

-

Silver

Package Equivalence Code

-

BGA1152,34X34,40

Reflow Temperature-Max (s)

-

NOT SPECIFIED

Rohs Code

-

Yes

Termination

-

Solder Cup

Connector Type

-

Plug, Female Sockets

Number of Positions

-

5 (3 + 2 Fiber Optic)

Applications

-

Transportation

Fastening Type

-

Threaded

Subcategory

-

Field Programmable Gate Arrays

Current Rating (Amps)

-

30A

Technology

-

CMOS

Orientation

-

Keyed

Shielding

-

Unshielded

Peak Reflow Temperature (Cel)

-

NOT SPECIFIED

Shell Finish

-

Black Chrome

Shell Size - Insert

-

-

Number of Outputs

-

396

Qualification Status

-

Not Qualified

Power Supplies

-

0.9 V

Shell Size, MIL

-

-

Cable Opening

-

-

Number of Inputs

-

396

Number of Logic Cells

-

480000

Contact Finish Thickness - Mating

-

-

Material Flammability Rating

-

UL94 V-0

Pricing(USD)
Grads Price
-
-
Availability

-

-

Price

-

-

Quantity

In Stock