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10AX115N3F45E2LG vs 10AX115S2F45I2SGE2

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Mfr. Part #	10AX115N3F45E2LG	10AX115S2F45I2SGE2
Manufacturer	ALTERA	ALTERA
Description	IC FPGA 768 I/O 1932FCBGA	IC FPGA 624 I/O 1932FCBGA
Datasheet
RoHS
Specifications
Package / Case	1206 (3216 Metric)	2010 (5025 Metric)
Mounting Type	Surface Mount	Surface Mount
Mount	Surface Mount	-
Surface Mount	YES	YES
Supplier Device Package	1206	2010
Number of Terminals	1932	1932
Package	Tape & Reel (TR)	Tape & Reel (TR)
Mfr	KOA Speer Electronics, Inc.	Kamaya Inc.
Product Status	Active	Active
Number of I/Os	768	624
RoHS	Compliant	Details
Moisture Sensitive	Yes	Yes
Shipping Restrictions	This product may require additional documentation to export from the United States.	This product may require additional documentation to export from the United States.
Number of Logic Elements	1150000 LE	1150000 LE
Supply Voltage-Max	930 mV	930 mV
Factory Pack QuantityFactory Pack Quantity	12	1
Supply Voltage-Min	870 mV	870 mV
Mounting Styles	SMD/SMT	SMD/SMT
Number of Logic Array Blocks - LABs	53400 LAB	53400 LAB
Part # Aliases	967557	985556
Manufacturer	Intel	Intel
Brand	Intel / Altera	Intel / Altera
Tradename	Arria 10 FPGA	Arria 10 FPGA
Package Description	BGA, BGA1932,44X44,40	BGA,
Package Style	GRID ARRAY	GRID ARRAY
Moisture Sensitivity Levels	3	-
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA1932,44X44,40	-
Supply Voltage-Nom	0.9 V	0.9 V
Reflow Temperature-Max (s)	NOT SPECIFIED	-
Operating Temperature-Max	100 °C	100 °C
Rohs Code	Yes	-
Manufacturer Part Number	10AX115N3F45E2LG	10AX115S2F45I2SGE2
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	INTEL CORP	INTEL CORP
Risk Rank	5.38	5.59
Operating Temperature	-55°C ~ 155°C	-55°C ~ 155°C
Series	SG73G	RMC
Packaging	Tray	Tray
Size / Dimension	0.126 L x 0.063 W (3.20mm x 1.60mm)	0.197 L x 0.098 W (5.00mm x 2.50mm)
Tolerance	±0.5%	±5%
JESD-609 Code	e1	-
Part Status	Active	Discontinued at Digi-Key
Number of Terminations	2	2
Temperature Coefficient	±50ppm/°C	±200ppm/°C
Resistance	1.07 kOhms	391 Ohms
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	-
Max Operating Temperature	100 °C	-
Min Operating Temperature	0 °C	-
Composition	Thick Film	Thick Film
Power (Watts)	0.5W, 1/2W	0.75W, 3/4W
HTS Code	8542.39.00.01	8542.39.00.01
Subcategory	Programmable Logic ICs	Programmable Logic ICs
Technology	CMOS	-
Voltage - Supply	0.87 V ~ 0.93 V	0.87 V ~ 0.98 V
Terminal Position	BOTTOM	BOTTOM
Terminal Form	BALL	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED	-
Terminal Pitch	1 mm	1 mm
Reach Compliance Code	compliant	compliant
JESD-30 Code	S-PBGA-B1932	S-PBGA-B1932
Number of Outputs	768	-
Qualification Status	Not Qualified	-
Failure Rate	-	-
Power Supplies	0.9 V	-
Temperature Grade	OTHER	INDUSTRIAL
RAM Size	8.2 MB	-
Number of Inputs	768	-
Seated Height-Max	3.65 mm	3.5 mm
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells	1150000	1150000
Product Type	FPGA - Field Programmable Gate Array	FPGA - Field Programmable Gate Array
Total RAM Bits	68857856	68857856
Number of LABs/CLBs	427200	427200
Number of Logic Blocks (LABs)	427200	-
Number of Logic Cells	1150000	-
Features	Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding	-
Product Category	FPGA - Field Programmable Gate Array	FPGA - Field Programmable Gate Array
Height Seated (Max)	0.028 (0.70mm)	0.028 (0.70mm)
Width	45 mm	45 mm
Length	45 mm	45 mm
Ratings	-	-
Operating Temperature-Min	-	-40 °C
Organization	-	42720 CLBS
Number of CLBs	-	42720
Pricing(USD)
Grads Price	Quantity Unit Price 1+ $11366.32109 10+ $10992.57359 25+ $10916.16046 50+ $10840.27851 100+ $10617.3149 500+ $9858.23111	-
Availability	577	-
Price	$11366.32109	-
Quantity

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10AX115N3F45E2LG vs 10AX115S2F45I2SGE2

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