| Mfr. Part # | 10AX115S3F45I3SGES | 10AX115H3F34E2LG |
| Manufacturer | ALTERA | ALTERA |
| Description | IC FPGA 624 I/O 1932FCBGA | IC FPGA 504 I/O 1152FCBGA |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Mounting Type | Panel Mount, Through Hole | Surface Mount |
Package / Case | 1932-BBGA, FCBGA | Axial |
Mounting Feature | Flange | - |
Shell Material | Stainless Steel | - |
Supplier Device Package | 1932-FBGA, FC (45x45) | Axial |
Package | Retail Package | Bulk |
Primary Material | Metal | - |
Mfr | Glenair | Vishay Dale |
Product Status | Active | Active |
Contact Materials | Copper Alloy | - |
Contact Finish Mating | Gold | - |
Number of I/Os | 624 | 504 |
Operating Temperature | -65°C ~ 175°C | -65°C ~ 175°C |
Series | 806 | Military, MIL-PRF-55182/05, RNC65 |
Part Status | Obsolete | Active |
Termination | Solder | - |
Connector Type | Plug, Male Pins | - |
Color | Silver | - |
Fastening Type | Threaded | - |
Voltage - Supply | 0.87 V ~ 0.93 V | 0.87 V ~ 0.93 V |
Orientation | B | - |
Shell Finish | Passivated | - |
Shell Size - Insert | 26-21 | - |
Number of Logic Elements/Cells | 1150000 | 1150000 |
Total RAM Bits | 68857856 | 68857856 |
Number of LABs/CLBs | 427200 | 427200 |
Features | Ground | Military, Moisture Resistant, Weldable |
Mount | - | Surface Mount |
Surface Mount | - | YES |
Number of Terminals | - | 1152 |
Base Product Number | - | RNC65 |
RoHS | - | Compliant |
Package Description | - | BGA, BGA1152,34X34,40 |
Package Style | - | GRID ARRAY |
Package Body Material | - | PLASTIC/EPOXY |
Package Equivalence Code | - | BGA1152,34X34,40 |
Supply Voltage-Nom | - | 0.9 V |
Reflow Temperature-Max (s) | - | NOT SPECIFIED |
Supply Voltage-Min | - | 0.87 V |
Operating Temperature-Max | - | 100 °C |
Rohs Code | - | Yes |
Manufacturer Part Number | - | 10AX115H3F34E2LG |
Risk Rank | - | 5.38 |
Supply Voltage-Max | - | 0.93 V |
Ihs Manufacturer | - | INTEL CORP |
Part Life Cycle Code | - | Active |
Manufacturer | - | Intel Corporation |
Package Shape | - | SQUARE |
Package Code | - | BGA |
Size / Dimension | - | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) |
Tolerance | - | ±1% |
Number of Terminations | - | 2 |
Temperature Coefficient | - | ±100ppm/°C |
Resistance | - | 392 Ohms |
Max Operating Temperature | - | 100 °C |
Min Operating Temperature | - | 0 °C |
Composition | - | Metal Film |
Power (Watts) | - | 0.5W, 1/2W |
HTS Code | - | 8542.39.00.01 |
Subcategory | - | Field Programmable Gate Arrays |
Technology | - | CMOS |
Terminal Position | - | BOTTOM |
Terminal Form | - | BALL |
Peak Reflow Temperature (Cel) | - | NOT SPECIFIED |
Terminal Pitch | - | 1 mm |
Reach Compliance Code | - | compliant |
JESD-30 Code | - | S-PBGA-B1152 |
Number of Outputs | - | 504 |
Qualification Status | - | Not Qualified |
Failure Rate | - | R (0.01%) |
Power Supplies | - | 0.9 V |
Temperature Grade | - | OTHER |
RAM Size | - | 8.2 MB |
Number of Inputs | - | 504 |
Seated Height-Max | - | 3.65 mm |
Programmable Logic Type | - | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Blocks (LABs) | - | 427200 |
Number of Logic Cells | - | 1150000 |
Height Seated (Max) | - | - |
Width | - | 35 mm |
Length | - | 35 mm |
| Pricing(USD) | ||
| Grads Price | - | - |
| Availability | - | - |
| Price | - | - |
| Quantity |
In Stock