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HomeAll CategoryComparison10ax115u1f45i2sges_46244474-vs-10ax115h4f34i3sg_46026996

Comparison

10AX115U1F45I2SGES vs 10AX115H4F34I3SG
Mfr. Part # 10AX115U1F45I2SGES

10AX115H4F34I3SG

Manufacturer ALTERAALTERA
Description

IC FPGA 480 I/O 1932FCBGA

IC FPGA 504 I/O 1152FCBGA

Datasheet
RoHS
Specifications

Package / Case

0805 (2012 Metric)

Axial

Mounting Type

Surface Mount

Surface Mount

Mount

Surface Mount

-

Supplier Device Package

0805

Axial

Package

Tape & Reel (TR)

Tape & Box (TB)

Base Product Number

RN732A

-

Mfr

KOA Speer Electronics, Inc.

Stackpole Electronics Inc

Product Status

Obsolete

Active

RoHS

Compliant

-

Number of I/Os

480

504

Operating Temperature

-55°C ~ 155°C

-55°C ~ 155°C

Series

RN73

RNF

Size / Dimension

0.079 L x 0.049 W (2.00mm x 1.25mm)

0.093 Dia x 0.250 L (2.35mm x 6.35mm)

Tolerance

±0.1%

±0.1%

Part Status

Obsolete

Active

Number of Terminations

2

2

Temperature Coefficient

±25ppm/°C

±25ppm/°C

Resistance

90.9 kOhms

25.8 kOhms

Max Operating Temperature

100 °C

-

Min Operating Temperature

-40 °C

-

Composition

Thin Film

Metal Film

Power (Watts)

0.1W, 1/10W

0.25W, 1/4W

Voltage - Supply

0.87 V ~ 0.93 V

0.87 V ~ 0.93 V

Memory Size

8.1 MB

-

RAM Size

8.2 MB

-

Data Rate

17.4 Gbps

-

Number of Logic Elements/Cells

1150000

1150000

Total RAM Bits

68857856

68857856

Number of LABs/CLBs

427200

427200

Number of Logic Blocks (LABs)

427200

-

Number of Transceivers

96

-

Features

Moisture Resistant

Flame Retardant Coating, Safety

Height Seated (Max)

0.024 (0.60mm)

-

Surface Mount

-

YES

Number of Terminals

-

1152

Package Description

-

BGA, BGA1152,34X34,40

Package Style

-

GRID ARRAY

Package Body Material

-

PLASTIC/EPOXY

Package Equivalence Code

-

BGA1152,34X34,40

Operating Temperature-Min

-

-40 °C

Supply Voltage-Nom

-

0.9 V

Reflow Temperature-Max (s)

-

NOT SPECIFIED

Supply Voltage-Min

-

0.87 V

Operating Temperature-Max

-

100 °C

Rohs Code

-

Yes

Manufacturer Part Number

-

10AX115H4F34I3SG

Package Code

-

BGA

Package Shape

-

SQUARE

Manufacturer

-

Intel Corporation

Part Life Cycle Code

-

Active

Ihs Manufacturer

-

INTEL CORP

Supply Voltage-Max

-

0.93 V

Risk Rank

-

5.38

HTS Code

-

8542.39.00.01

Subcategory

-

Field Programmable Gate Arrays

Technology

-

CMOS

Terminal Position

-

BOTTOM

Terminal Form

-

BALL

Peak Reflow Temperature (Cel)

-

NOT SPECIFIED

Terminal Pitch

-

1 mm

Reach Compliance Code

-

compliant

JESD-30 Code

-

S-PBGA-B1152

Number of Outputs

-

504

Qualification Status

-

Not Qualified

Failure Rate

-

-

Power Supplies

-

0.9 V

Temperature Grade

-

INDUSTRIAL

Number of Inputs

-

504

Seated Height-Max

-

3.65 mm

Programmable Logic Type

-

FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Cells

-

1150000

Width

-

35 mm

Length

-

35 mm

Pricing(USD)
Grads Price
-
-
Availability

-

-

Price

-

-

Quantity

In Stock