| Mfr. Part # | 10AX115U2F45I2SGE2 | 10AX115S3F45I2LG |
| Manufacturer | ALTERA | ALTERA |
| Description | IC FPGA 480 I/O 1932FCBGA | IC FPGA 624 I/O 1932FCBGA |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Package / Case | 0603 (1608 Metric) | 0805 (2012 Metric) |
Mounting Type | Surface Mount | Surface Mount |
Surface Mount | YES | YES |
Supplier Device Package | 0603 | 0805 |
Number of Terminals | 1932 | 1932 |
Package | Bulk | Tape & Reel (TR) |
Mfr | Stackpole Electronics Inc | KOA Speer Electronics, Inc. |
Product Status | Active | Obsolete |
Number of I/Os | 480 | 624 |
Moisture Sensitive | Yes | - |
Shipping Restrictions | This product may require additional documentation to export from the United States. | - |
Number of Logic Elements | 1150000 LE | - |
Supply Voltage-Max | 930 mV | 0.93 V |
Factory Pack QuantityFactory Pack Quantity | 1 | - |
Supply Voltage-Min | 870 mV | 0.87 V |
Mounting Styles | SMD/SMT | - |
Number of Logic Array Blocks - LABs | 53400 LAB | - |
Part # Aliases | 967105 | - |
Manufacturer | Intel | Intel Corporation |
Brand | Intel / Altera | - |
Tradename | Arria 10 FPGA | - |
RoHS | Details | Compliant |
Package Description | BGA, | BGA, BGA1932,44X44,40 |
Package Style | GRID ARRAY | GRID ARRAY |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Operating Temperature-Min | -40 °C | -40 °C |
Supply Voltage-Nom | 0.9 V | 0.9 V |
Operating Temperature-Max | 100 °C | 100 °C |
Manufacturer Part Number | 10AX115U2F45I2SGE2 | 10AX115S3F45I2LG |
Package Code | BGA | BGA |
Package Shape | SQUARE | SQUARE |
Part Life Cycle Code | Obsolete | Active |
Ihs Manufacturer | INTEL CORP | INTEL CORP |
Risk Rank | 5.59 | 5.39 |
Operating Temperature | -55°C ~ 155°C | -55°C ~ 155°C |
Series | RMEF | RN73 |
Packaging | Tray | - |
Size / Dimension | 0.063 L x 0.031 W (1.60mm x 0.80mm) | 0.079 L x 0.049 W (2.00mm x 1.25mm) |
Tolerance | ±1% | ±0.25% |
Part Status | Discontinued at Digi-Key | Active |
Number of Terminations | 2 | 2 |
Temperature Coefficient | ±100ppm/°C | ±50ppm/°C |
Resistance | 1.18 kOhms | 215 kOhms |
Composition | Thick Film | Thin Film |
Power (Watts) | 0.1W, 1/10W | 0.1W, 1/10W |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Subcategory | Programmable Logic ICs | Field Programmable Gate Arrays |
Voltage - Supply | 0.87 V ~ 0.98 V | 0.87 V ~ 0.93 V |
Terminal Position | BOTTOM | BOTTOM |
Terminal Form | BALL | BALL |
Terminal Pitch | 1 mm | 1 mm |
Reach Compliance Code | compliant | compliant |
JESD-30 Code | S-PBGA-B1932 | S-PBGA-B1932 |
Failure Rate | - | - |
Temperature Grade | INDUSTRIAL | INDUSTRIAL |
Organization | 42720 CLBS | - |
Seated Height-Max | 3.5 mm | 3.65 mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells | 1150000 | 1150000 |
Product Type | FPGA - Field Programmable Gate Array | - |
Total RAM Bits | 68857856 | 68857856 |
Number of LABs/CLBs | 427200 | 427200 |
Number of CLBs | 42720 | - |
Features | Automotive AEC-Q200 | Moisture Resistant |
Product Category | FPGA - Field Programmable Gate Array | - |
Height Seated (Max) | 0.020 (0.50mm) | 0.024 (0.60mm) |
Width | 45 mm | 45 mm |
Length | 45 mm | 45 mm |
Ratings | AEC-Q200 | - |
Mount | - | Surface Mount |
Base Product Number | - | RN732A |
Package Equivalence Code | - | BGA1932,44X44,40 |
Reflow Temperature-Max (s) | - | NOT SPECIFIED |
Rohs Code | - | Yes |
Max Operating Temperature | - | 100 °C |
Min Operating Temperature | - | -40 °C |
Technology | - | CMOS |
Peak Reflow Temperature (Cel) | - | NOT SPECIFIED |
Number of Outputs | - | 624 |
Qualification Status | - | Not Qualified |
Power Supplies | - | 0.9 V |
RAM Size | - | 8.2 MB |
Number of Inputs | - | 624 |
Number of Logic Blocks (LABs) | - | 427200 |
Number of Logic Cells | - | 1150000 |
| Pricing(USD) | ||
| Grads Price | - | - |
| Availability | - | - |
| Price | - | - |
| Quantity |
In Stock