| Mfr. Part # | 5CSEBA4U23C8N | 5CSEBA4U23A7N |
| Manufacturer | ALTERA | ALTERA |
| Description | IC FPGA 188 I/O 672UBGA | IC FPGA 188 I/O 672UBGA |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Package / Case | 672-FBGA | 672-FBGA |
Number of Pins | 484 | - |
Supplier Device Package | 672-UBGA (23x23) | 672-UBGA (23x23) |
Manufacturer | TAIWAN SEMICONDUCTOR | Intel Corporation |
Number of I/Os | MCU - 181, FPGA - 145 | MCU - 181, FPGA - 145 |
RoHS | Compliant | - |
Packaging | SOT-23 | Tray |
Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) |
Series | Cyclone® V SE | Automotive, AEC-Q100, Cyclone® V SE |
Part Status | Active | Active |
Max Operating Temperature | 85 °C | - |
Min Operating Temperature | 0 °C | - |
Frequency | 600 MHz | - |
Operating Supply Voltage | 1.1 V | - |
Voltage | Supply Voltage Maximum - 6V | - |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - |
Memory Size | 2.9 MB | - |
Speed | 600MHz | 700MHz |
RAM Size | 64KB | 64KB |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals | DMA, POR, WDT | DMA, POR, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA | MCU, FPGA |
Number of Logic Elements/Cells | 40000 | - |
Core Architecture | ARM | - |
Primary Attributes | FPGA - 40K Logic Elements | FPGA - 40K Logic Elements |
Flash Size | -- | -- |
Surface Mount | - | YES |
Number of Terminals | - | 672 |
Risk Rank | - | 5.57 |
Supply Voltage-Max | - | 1.13 V |
Ihs Manufacturer | - | INTEL CORP |
Part Life Cycle Code | - | Active |
Package Shape | - | SQUARE |
Package Code | - | FBGA |
Manufacturer Part Number | - | 5CSEBA4U23A7N |
Rohs Code | - | Yes |
Operating Temperature-Max | - | 125 °C |
Supply Voltage-Min | - | 1.07 V |
Reflow Temperature-Max (s) | - | NOT SPECIFIED |
Supply Voltage-Nom | - | 1.1 V |
Operating Temperature-Min | - | -40 °C |
Package Equivalence Code | - | BGA672,28X28,32 |
Package Body Material | - | PLASTIC/EPOXY |
Package Style | - | GRID ARRAY, FINE PITCH |
Package Description | - | FBGA, BGA672,28X28,32 |
HTS Code | - | 8542.39.00.01 |
Subcategory | - | Field Programmable Gate Arrays |
Technology | - | CMOS |
Terminal Position | - | BOTTOM |
Terminal Form | - | BALL |
Peak Reflow Temperature (Cel) | - | NOT SPECIFIED |
Terminal Pitch | - | 0.8 mm |
Reach Compliance Code | - | compliant |
JESD-30 Code | - | S-PBGA-B672 |
Number of Outputs | - | 145 |
Qualification Status | - | Not Qualified |
Power Supplies | - | 1.1,1.2/3.3,2.5 V |
Temperature Grade | - | AUTOMOTIVE |
Number of Inputs | - | 145 |
Seated Height-Max | - | 1.85 mm |
Programmable Logic Type | - | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Cells | - | 40000 |
Length | - | 23 mm |
Width | - | 23 mm |
| Pricing(USD) | ||
| Grads Price | Quantity Unit Price 1+ $144.67767 10+ $136.48837 100+ $128.76262 500+ $121.47416 1000+ $114.59827 | Quantity Unit Price 1+ $224.14002 10+ $211.45285 100+ $199.48382 500+ $188.19228 1000+ $177.53989 |
| Availability | 2730 | 2548 |
| Price | $144.67767 | $224.14002 |
| Quantity |
In Stock : 2730