| Mfr. Part # | A42MX36-1BG272M | A42MX36-1BGG272M |
| Manufacturer | Microchip Technology | Microchip Technology |
| Description | FPGA - Field Programmable Gate Array A42MX36-1BG272M | FPGA - Field Programmable Gate Array A42MX36-1BGG272M |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Lifecycle Status | Production (Last Updated: 2 months ago) | Production (Last Updated: 2 months ago) |
Package / Case | BGA-272 | BGA-272 |
Mount | Surface Mount | Surface Mount |
Mounting Type | Surface Mount | Surface Mount |
Surface Mount | YES | YES |
Number of Pins | 272 | 272 |
Supplier Device Package | 272-PBGA (27x27) | 272-PBGA (27x27) |
Number of Terminals | 272 | 272 |
Tradename | Actel | Actel |
Factory Pack QuantityFactory Pack Quantity | 40 | 40 |
Moisture Sensitive | Yes | Yes |
Maximum Operating Frequency | 151 MHz | 151 MHz |
Mounting Styles | SMD/SMT | SMD/SMT |
Maximum Operating Temperature | + 125 C | + 125 C |
Minimum Operating Temperature | - 55 C | - 55 C |
Supply Voltage-Min | 3 V | 3 V |
Number of I/Os | 202 I/O | 202 I/O |
RoHS | N | Details |
Shipping Restrictions | This product may require additional documentation to export from the United States. | This product may require additional documentation to export from the United States. |
Supply Voltage-Max | 5.5 V | 5.5 V |
Package | Tray | Tray |
Base Product Number | A42MX36 | A42MX36 |
Mfr | Microchip Technology | Microchip Technology |
Product Status | Active | Obsolete |
Package Description | PLASTIC, BGA-272 | BGA, |
Package Style | GRID ARRAY | GRID ARRAY |
Moisture Sensitivity Levels | 3 | 3 |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Operating Temperature-Min | -55 °C | -55 °C |
Supply Voltage-Nom | 3.3 V | 3.3 V |
Reflow Temperature-Max (s) | 30 | 40 |
Operating Temperature-Max | 125 °C | 125 °C |
Rohs Code | No | Yes |
Manufacturer Part Number | A42MX36-1BG272M | A42MX36-1BGG272M |
Clock Frequency-Max | 83 MHz | 83 MHz |
Package Code | BGA | BGA |
Package Shape | SQUARE | SQUARE |
Part Life Cycle Code | Active | Active |
Ihs Manufacturer | MICROSEMI CORP | MICROSEMI CORP |
Risk Rank | 5.19 | 5.25 |
Part Package Code | BGA | - |
Packaging | Tray | Tray |
Series | A42MX36 | A42MX36 |
Operating Temperature | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) |
JESD-609 Code | e0 | e1 |
ECCN Code | 3A001.A.2.C | 3A001.A.2.C |
Terminal Finish | TIN LEAD SILVER | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 125 °C | 125 °C |
Min Operating Temperature | -55 °C | -55 °C |
Additional Feature | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Technology | CMOS | CMOS |
Voltage - Supply | 3.3 V, 5 V | 3.3 V, 5 V |
Terminal Position | BOTTOM | BOTTOM |
Terminal Form | BALL | BALL |
Peak Reflow Temperature (Cel) | 225 | 250 |
Terminal Pitch | 1.27 mm | 1.27 mm |
Reach Compliance Code | compliant | compliant |
JESD-30 Code | S-PBGA-B272 | S-PBGA-B272 |
Qualification Status | Not Qualified | Not Qualified |
Temperature Grade | MILITARY | MILITARY |
RAM Size | 320 B | 320 B |
Organization | 2438 CLBS, 54000 GATES | 2438 CLBS, 54000 GATES |
Seated Height-Max | 2.5 mm | 2.5 mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells | 1184 | 1184 |
Total RAM Bits | 2560 | 2560 |
Number of Gates | 54000 | 54000 |
Max Frequency | 151 MHz | 151 MHz |
Number of Logic Blocks (LABs) | 1184 | 1184 |
Speed Grade | 1 | 1 |
Number of Registers | 1822 | 1822 |
Combinatorial Delay of a CLB-Max | 2.3 ns | 2.3 ns |
Number of CLBs | 2438 | 2438 |
Voltage - Supply (Max) | 5.5 V | 5.5 V |
Voltage - Supply (Min) | 3 V | 3 V |
Number of Equivalent Gates | 54000 | 54000 |
Width | 27 mm | 27 mm |
Length | 27 mm | 27 mm |
Height | 1.73 mm | 1.73 mm |
Radiation Hardening | No | No |
| Pricing(USD) | ||
| Grads Price | - | - |
| Availability | - | - |
| Price | - | - |
| Quantity |
In Stock