| Mfr. Part # | EP2AGX65CU17C4 | EP2AGX65CU17C4N | EP2AGX65DF25C4N |
| Manufacturer | ALTERA | ALTERA | ALTERA |
| Description | IC FPGA 156 I/O 358UBGA | IC FPGA 156 I/O 358UBGA | IC FPGA 252 I/O 572FBGA |
| Datasheet | |||
| RoHS | |||
| Specifications | |||
Mounting Type | Surface Mount | Surface Mount | Surface Mount |
Package / Case | 358-LFBGA, FCBGA | 358-LFBGA, FCBGA | 572-BGA, FCBGA |
Supplier Device Package | 358-UBGA, FC (17x17) | 358-UBGA, FC (17x17) | 572-FBGA, FC (25x25) |
Number of I/Os | 156 | 156 | 252 |
Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Series | Arria II GX | Arria II GX | Arria II GX |
Part Status | Active | Active | Active |
Voltage - Supply | 0.87 V ~ 0.93 V | 0.87 V ~ 0.93 V | 0.87 V ~ 0.93 V |
Base Part Number | EP2AGX65 | EP2AGX65 | EP2AGX65 |
Number of Logic Elements/Cells | 60214 | 60214 | 60214 |
Total RAM Bits | 5371904 | 5371904 | 5371904 |
Number of LABs/CLBs | 2530 | 2530 | 2530 |
Surface Mount | - | YES | YES |
Number of Terminals | - | 358 | 572 |
Package Description | - | 17 X 17 MM, LEAD FREE, MO-275, UBGA-358 | 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 |
Package Style | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG |
Moisture Sensitivity Levels | - | 3 | 3 |
Package Body Material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Equivalence Code | - | BGA358,20X20,32 | BGA572,24X24,40 |
Supply Voltage-Nom | - | 0.9 V | 0.9 V |
Reflow Temperature-Max (s) | - | 40 | 40 |
Supply Voltage-Min | - | 0.87 V | 0.87 V |
Operating Temperature-Max | - | 85 °C | 85 °C |
Rohs Code | - | Yes | Yes |
Manufacturer Part Number | - | EP2AGX65CU17C4N | EP2AGX65DF25C4N |
Clock Frequency-Max | - | 500 MHz | 500 MHz |
Package Code | - | LFBGA | HBGA |
Package Shape | - | SQUARE | SQUARE |
Manufacturer | - | Intel Corporation | Intel Corporation |
Part Life Cycle Code | - | Obsolete | Obsolete |
Ihs Manufacturer | - | INTEL CORP | INTEL CORP |
Supply Voltage-Max | - | 0.93 V | 0.93 V |
Risk Rank | - | 5.26 | 5.25 |
JESD-609 Code | - | e1 | e1 |
ECCN Code | - | 3A991 | 3A991 |
Terminal Finish | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | - | 8542.39.00.01 | 8542.39.00.01 |
Subcategory | - | Field Programmable Gate Arrays | Field Programmable Gate Arrays |
Technology | - | CMOS | CMOS |
Terminal Position | - | BOTTOM | BOTTOM |
Terminal Form | - | BALL | BALL |
Peak Reflow Temperature (Cel) | - | 260 | 260 |
Terminal Pitch | - | 0.8 mm | 1 mm |
Reach Compliance Code | - | compliant | compliant |
JESD-30 Code | - | S-PBGA-B358 | S-PBGA-B572 |
Number of Outputs | - | 156 | 252 |
Qualification Status | - | Not Qualified | Not Qualified |
Power Supplies | - | 0.9,1.2/3.3,1.5,2.5 V | 0.9,1.2/3.3,1.5,2.5 V |
Temperature Grade | - | OTHER | OTHER |
Number of Inputs | - | 156 | 252 |
Seated Height-Max | - | 1.7 mm | 2.2 mm |
Programmable Logic Type | - | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Cells | - | 60214 | 60214 |
Width | - | 17 mm | 25 mm |
Length | - | 17 mm | 25 mm |
| Pricing(USD) | |||
| Grads Price | - | - | - |
| Availability | - | - | - |
| Price | - | - | - |
| Quantity |
In Stock
