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HomeAll CategoryComparisonmt29f32g08abcdbj46d_1779401-vs-mt29f32g08cbadal83a3wc1m_1740871

Comparison

MT29F32G08ABCDBJ4-6:D vs MT29F32G08CBADAL83A3WC1-M
Mfr. Part # MT29F32G08ABCDBJ4-6:D

MT29F32G08CBADAL83A3WC1-M

Manufacturer Micron Technology Inc.Micron Technology Inc.
Description

SLC NAND Flash Parallel/Serial 3.3V 32Gbit 4G X 8bit 132-Pin VBGA

NAND FLASH 4GX8 DIE-COM 3.3V MASS STORAGE

Datasheet
RoHS
Specifications

Contact Plating

Copper, Silver, Tin

-

Mount

Surface Mount

-

Mounting Type

Surface Mount

Surface Mount

Package / Case

132-VBGA

Die

Number of Pins

132

-

Supplier Device Package

132-VBGA (12x18)

-

Memory Types

Non-Volatile

Non-Volatile

Operating Temperature

0°C~70°C TA

0°C~70°C TA

Packaging

Tray

Tray

Published

2016

-

Part Status

Obsolete

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

-

Max Operating Temperature

70°C

-

Min Operating Temperature

0°C

-

Voltage - Supply

3.3V

2.7V~3.6V

Interface

Parallel, Serial

-

Memory Size

32Gb 4G x 8

32Gb 4G x 8

Clock Frequency

166MHz

-

Access Time

25 ns

-

Memory Format

FLASH

FLASH

Memory Interface

Parallel

Parallel

Density

32 Gb

-

Voltage - Supply (Max)

3.6V

-

Voltage - Supply (Min)

2.7V

-

Page Size

16kB

-

Radiation Hardening

No

-

RoHS Status

ROHS3 Compliant

RoHS Compliant

Factory Lead Time

-

6 Weeks

Pricing(USD)
Grads Price
-
-
Availability

5000

-

Price

-

-

Quantity

In Stock : 5000