Aries Electronics 22-350000-10 Adapter & Breakout BoardsFR4 Epoxy Glass 22Positions
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Min.: 1 Mult.: 1
22-350000-10
196-719-22-350000-10
SOIC
Material: FR4 Epoxy Glass, Number of Positions: 22Positions, Board Thickness: 0.062 1.57mm 1/16
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22-350000-10 Tech Specifications
22-350000-10 Tech Specifications
Aries Electronics 22-350000-10 technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 22-350000-10.
| Product Attribute | Attribute Value | |
|---|---|---|
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Mount | Through Hole | |
| Package / Case | SOIC | |
| Number of Pins | 22Pins | |
| Material | FR4 Epoxy Glass |
| Product Attribute | Attribute Value | |
|---|---|---|
| Series | Correct-A-Chip® 350000 | |
| Published | 2006 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Number of Positions | 22Positions |
| Product Attribute | Attribute Value | |
|---|---|---|
| Pitch | 0.050 1.27mm | |
| Lead Length | 3.175mm | |
| Proto Board Type | SMD to DIP | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant |
22-350000-10 Documents
22-350000-10 Documents
Download datasheets and manufacturer documentation for 22-350000-10
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