Cypress Semiconductor CY7C1372DV25-200BZC Memory ICs
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CY7C1372DV25-200BZC
Terminal Position: BOTTOM, Number of Pins: 165Pins
RoHS Compliant
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Min.: 1 Mult.: 1
603-535-CY7C1372DV25-200BZC
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CY7C1372DV25-200BZC Tech Specifications
CY7C1372DV25-200BZC Tech Specifications
Cypress Semiconductor CY7C1372DV25-200BZC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor CY7C1372DV25-200BZC.
| Product Attribute | Attribute Value | |
|---|---|---|
| Surface Mount | YES | |
| Number of Pins | 165Pins | |
| Number of Terminals | 165Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | |
| Access Time-Max | 3 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Number of Words | 1048576 wordsWord | |
| Number of Words Code | 1000000Words Codes | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 |
| Product Attribute | Attribute Value | |
|---|---|---|
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| JESD-609 Code | e0 | |
| ECCN Code | 3A991.B.2.A | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| HTS Code | 8542.32.00.41 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-PBGA-B165 | |
| Qualification Status | Not Qualified |
| Product Attribute | Attribute Value | |
|---|---|---|
| Temperature Grade | COMMERCIAL | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.3 mA | |
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 18 | |
| Standby Current-Max | 0.07 A | |
| Memory Density | 18874368 bit | |
| Parallel/Serial | PARALLEL | |
| I/O Type | COMMON | |
| Memory IC Type | ZBT SRAM | |
| Standby Voltage-Min | 2.38 V | |
| Voltage - Supply (Max) | 2.625 V | |
| Voltage - Supply (Min) | 2.375 V | |
| Width | 13 mm | |
| Length | 15 mm |
CY7C1372DV25-200BZC Documents
CY7C1372DV25-200BZC Documents
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Datasheets
CY7C1372DV25-200BZC Documents
CY7C1372DV25-200BZC Comparison
CY7C1372DV25-200BZC Comparison
The parts on the right have similar specifications to Cypress Semiconductor & CY7C1372DV25-200BZC.
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CY7C1372DV25-200BZC
Cypress Semiconductor
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