Micron Technology Inc. NAND04GR3B2DN6E Memory ICsFLASH Tray
NAND04GR3B2DN6E
Terminal Position: DUAL, Memory Format: FLASH, Number of Pins: 48Pins
RoHS Compliant
Datasheet Inquiry
Min.: 1 Mult.: 1
1616-535-NAND04GR3B2DN6E
48-TFSOP (0.724, 18.40mm Width)
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NAND04GR3B2DN6E Tech Specifications
NAND04GR3B2DN6E Tech Specifications
Micron Technology Inc. NAND04GR3B2DN6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND04GR3B2DN6E.
| Product Attribute | Attribute Value | |
|---|---|---|
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 48-TFSOP (0.724, 18.40mm Width) | |
| Number of Pins | 48Pins | |
| Memory Types | Non-Volatile | |
| Current - Supply (Nom) | 20mA | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Published | 2010 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Discontinued | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 48Terminations | |
| Terminal Finish | Matte Tin (Sn) | |
| Voltage - Supply | 1.8V |
| Product Attribute | Attribute Value | |
|---|---|---|
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Base Part Number | NAND04G | |
| Qualification Status | Not Qualified | |
| Memory Size | 4Gb 512M x 8 | |
| Memory Format | FLASH | |
| Memory Interface | Parallel | |
| Organization | 512MX8 | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | 25ns | |
| Address Bus Width | 1b | |
| Density | 4 Gb | |
| Standby Current-Max | 0.00005A |
| Product Attribute | Attribute Value | |
|---|---|---|
| Access Time (Max) | 25000 ns | |
| Sync/Async | Asynchronous | |
| Word Size | 16b | |
| Data Polling | NO | |
| Toggle Bit | NO | |
| Voltage - Supply (Max) | 1.95V | |
| Voltage - Supply (Min) | 1.7V | |
| Command User Interface | YES | |
| Number of Sectors/Size | 4K | |
| Sector Size | 128K | |
| Page Size | 2Kwords | |
| Ready/Busy | YES | |
| Length | 18.4mm | |
| Height Seated (Max) | 1.2mm | |
| RoHS Status | ROHS3 Compliant |
NAND04GR3B2DN6E Documents
NAND04GR3B2DN6E Documents
Download datasheets and manufacturer documentation for NAND04GR3B2DN6E
Datasheets
NAND04G-B2D, NAND08G-BxC
NAND04GR3B2DN6E Comparison
NAND04GR3B2DN6E Comparison
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Mfr. Part #
Manufacturer
Moisture Sensitivity Level (MSL)
Packaging
Package / Case
Memory Size
Memory Format
Operating Temperature
Voltage - Supply
Mounting Type
Availability
Price
Quantity
NAND04GR3B2DN6E
Micron Technology Inc.
3 (168 Hours)
Tray
48-TFSOP (0.724, 18.40mm Width)
4Gb 512M x 8
FLASH
-40°C~85°C TA
1.8V
Surface Mount
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- -
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3 (168 Hours)
Tray
48-TFSOP (0.724, 18.40mm Width)
4Gb 512M x 8
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1.8V
Surface Mount
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MX30UF4G18AC-TI
Macronix
3 (168 Hours)
Tray
48-TFSOP (0.724, 18.40mm Width)
4Gb 512M x 8
FLASH
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1.8V
Surface Mount
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Cypress Semiconductor Corp
3 (168 Hours)
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48-TFSOP (0.724, 18.40mm Width)
4Gb 512M x 8
FLASH
-40°C~85°C TA
1.8V
Surface Mount
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$10.51863
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TC58NVG2S0HBAI4
Kioxia America, Inc.
3 (168 Hours)
Tray
48-TFSOP (0.724, 18.40mm Width)
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-40°C~85°C TA
1.8V
Surface Mount
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