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Texas Instruments OMAP3525DZCBCA Embedded MicroprocessorsTray OMAP-35xx 515Terminations

OMAP3525DZCBCA
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OMAP3525DZCBCA
2502-490-OMAP3525DZCBCA
Texas Instruments
515-VFBGA, FCBGA
uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC, Core Processor: ARM® Cortex®-A8, RAM Controllers: LPDDR, Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD
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OMAP3525DZCBCA Tech Specifications

Texas Instruments OMAP3525DZCBCA technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments OMAP3525DZCBCA.

Product Attribute Attribute Value
MountSurface Mount
Package / Case515-VFBGA, FCBGA
Number of Pins515Pins
Memory TypesL2 Cache, ROM, SRAM
Operating Temperature-40°C~105°C TJ
PackagingTray
SeriesOMAP-35xx
JESD-609 Codee1
Part StatusObsolete
Moisture Sensitivity Level (MSL)3 (168 Hours)
Number of Terminations515Terminations
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal PositionBOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel)260
Terminal Pitch0.5mm
Frequency600MHz
Base Part NumberOMAP3525
Pin Count515
Voltage1.35V
Max Supply Voltage1.35V
Min Supply Voltage985mV
RAM Size64kB
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
Core ProcessorARM® Cortex®-A8
Data Bus Width32b
Address Bus Width26
Core ArchitectureARM
Boundary ScanYES
Low Power ModeYES
FormatFLOATING POINT
Integrated CacheYES
Voltage - I/O1.8V 3.0V
Number of UART Channels3UART Channels
Number of Cores/Bus Width1 Core 32-Bit
Graphics AccelerationYes
RAM ControllersLPDDR
USBUSB 1.x (3), USB 2.0 (1)
Additional InterfacesHDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMD
Display & Interface ControllersLCD
Length14mm
Height Seated (Max)1mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead FreeContains Lead
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OMAP3525DZCBCA Documents

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