AP63205WU-7 Switching Voltage Regulator: 5V 2A TSOT26, AP63205WU-7 Regulators Datasheet

The AP63205WU-7  is a 2A switching voltage regulator having a 3.8V to 32V input voltage range. A 125m high-side power MOSFET  and a 68m low-side power MOSFET  are fully integrated. To achieve high-efficiency step-down  DC/DC  conversion, a power MOSFET  is used.

The AP63205WU-7  device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network.

AP63205WU-7 Pinout 

AP63205WU-7 Symbol

AP63205WU-7 Footprint

AP63205WU-7  3D Model

Diodes Incorporated AP63205WU-7 technical specifications, attributes, parameters and parts with similar specifications to Diodes Incorporated AP63205WU-7.

• VIN 3.8V to 32V

• 2A Continuous Output Current

• 0.8V ± 1% Reference Voltage 

• 22µA Ultralow Quiescent Current

• Switching Frequency

  500 kHz: AP63200 and AP63201

  1.1MHz: AP63203 and AP63205

• Pulse Width Modulation (PWM) Regardless of Output Load 

  AP63201

• Supports Pulse Frequency Modulation (PFM)

  AP63200, AP63203, and AP63205

  Up to 80% Efficiency  at 1mA Light Load

  Up to 88% Efficiency  at 5mA Light Load

• Fixed Output Voltage 

  3.3V: AP63203

  5.0V: AP63205

• Proprietary Gate Driver Design for Best EMI Reduction

• Frequency Spread Spectrum (FSS) to Reduce EMI

• Precision Enable Threshold to Adjust UVLO

• Protection Circuitry

  Overvoltage Protection

  Cycle-by-Cycle Peak Current Limit

  Thermal Shutdown

• Lead-Free & Fully  RoHS Compliant 

• Halogen and Antimony Free “Green” Device 

The following is AP63205WU-7 Functional Block Diagram:

AP63205WU-7 Functional Block Diagram

The following is the application circuit of AP63205WU-7:

AP63205WU-7 Application Circuit

• The AP63205WU-7  PCB device works at 2A current load, so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top and bottom layers is recommended.

• Provide sufficient vias for the input and output capacitors’ GND side to dissipate heat to the bottom layer.

• Make the bottom layer under the device the GND layer for heat dissipation. The GND layer should be as large as possible to provide a better thermal effect.

• Place the VIN capacitors as close to the device as possible.

• Place the feedback components as close to FB as possible.

The following is the PCB layout of AP63205WU-7 :

AP63205WU-7 PCB Layout

AP63205WU-7 Package Dimensions

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.