● Single 1.7V - 3.6V supply
● Serial Peripheral Interface (SPI) compatible
◆ Supports SPI modes 0 and 3
◆ Supports RapidS™ operation
● Continuous read capability through entire array
◆ Up to 85MHz
◆ Low-power read option up to 15MHz
◆ Clock-to-output time (tV) of 6ns maximum
● User configurable page size
◆ 256 bytes per page
◆ 264 bytes per page (default)
◆ Page size can be factory pre-configured for 256 bytes
● Two fully independent SRAM data buffers (256/264 bytes)
◆ Allows receiving data while reprogramming the main memory array
● Flexible programming options
◆ Byte/Page Program (1 to 256/264 bytes) directly into main memory
◆ Buffer Write
◆ Buffer to Main Memory Page Program
● Flexible erase options
◆ Page Erase (256/264 bytes)
◆ Block Erase (2KB)
◆ Sector Erase (64KB)
◆ Chip Erase (8-Mbits)
● Program and Erase Suspend/Resume
● Advanced hardware and software data protection features
◆ Individual sector protection
◆ Individual sector lockdown to make any sector permanently read-only
● 128-byte, One-Time Programmable (OTP) Security Register
◆ 64 bytes factory programmed with a unique identifier
◆ 64 bytes user programmable
● Hardware and software controlled reset options
● JEDEC Standard Manufacturer and Device ID Read
● Low-power dissipation
◆ 400nA Ultra-Deep Power-Down current (typical)
◆ 4.5µA Deep Power-Down current (typical)
◆ 25µA Standby current (typical)
◆ 11mA Active Read current (typical at 20MHz)
● Endurance: 100,000 program/erase cycles per page minimum
● Data retention: 20 years
● Complies with full industrial temperature range
● Green (Pb/Halide-free/RoHS compliant) packaging options
◆ 8-lead SOIC (0.150" wide and 0.208" wide)
◆ 8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
◆ 8-ball (2 x4 Array) Wafer Level Chip Scale Package
◆ Die in Wafer Form