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LPC824M201JHI33E Microcontroller: Datasheet, Pinout, Application

IC MCU 32BIT 32KB FLASH 32HVQFN This article will unlock more detailed information about LPC824M201JHI33E, a 32-bit ARM? Cortex?-M0+ microcontroller.

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Aug 19, 2021

Darlene Bunyan

IC MCU 32BIT 32KB FLASH 32HVQFN

This article will unlock more detailed information about LPC824M201JHI33E, a 32-bit ARM® Cortex®-M0 microcontroller.

LPC824M201JHI33E

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LPC824M201JHI33E Pinout

LPC824M201JHI33E CAD Model

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LPC824M201JHI33E Description

LPC824M201JHI33E is a 32-bit ARM® Cortex®-M0+ microcontroller from the LPC82x family operating at CPU frequencies of up to 30 MHz. And the LPC82x support up to 32 KB of flash memory and 8 KB of SRAM.

Specifications

NXP USA Inc. LPC824M201JHI33E technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. LPC824M201JHI33E.

LPC824M201JHI33E Tech Specifications

NXP USA Inc. LPC824M201JHI33E technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. LPC824M201JHI33E.

Product Attribute Attribute Value
Factory Lead Time12 Weeks
Mounting TypeSurface Mount
Package / Case32-VFQFN Exposed Pad
Surface MountYES
Data ConvertersA/D 12x12b
Number of I/Os29I/Os
ROM(word)32768
Operating Temperature-40°C~105°C TA
PackagingTray
SeriesLPC82x
Published2005
Part StatusDiscontinued
Moisture Sensitivity Level (MSL)3 (168 Hours)
Number of Terminations33Terminations
Additional FeatureSEATED HGT-NOM
Terminal PositionQUAD
Product Attribute Attribute Value
Terminal FormNO LEAD
Peak Reflow Temperature (Cel)260
Supply Voltage3.3V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Base Part NumberLPC824M201
Pin Count32
JESD-30 CodeS-PQCC-N33
Supply Voltage-Max (Vsup)3.6V
Supply Voltage-Min (Vsup)1.8V
Oscillator TypeInternal
Speed30MHz
RAM Size8K x 8
Voltage - Supply (Vcc/Vdd)1.8V~3.6V
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Core ProcessorARM® Cortex®-M0+
Product Attribute Attribute Value
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Clock Frequency25MHz
Program Memory TypeFLASH
Core Size32-Bit
Program Memory Size32KB 32K x 8
ConnectivityI2C, SPI, UART/USART
Bit Size32
Has ADCYES
DMA ChannelsYES
PWM ChannelsYES
DAC ChannelsNO
On Chip Program ROM Width8
Length5mm
Height Seated (Max)0.85mm
Width5mm
RoHS StatusROHS3 Compliant
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LPC824M201JHI33E Features

lSystem:

 ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to 30 MHz with single-cycle multiplier and fast single-cycle I/O port.

 ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).

 System tick timer.

 AHB multilayer matrix.

 Serial Wire Debug (SWD) with four breakpoints and two watchpoints. JTAG boundary-scan (BSDL) supported.

 MTB

lMemory:

 Up to 32 KB on-chip flash programming memory with 64 Byte page write and erase. Code Read Protection (CRP) supported.

 8 KB SRAM.

lROM API support:

 Boot loader.

 On-chip ROM APIs for ADC, SPI, I2C, USART, power configuration (power profiles) and integer divide.

 Flash In-Application Programming (IAP) and In-System Programming (ISP).

lDigital peripherals:

 High-speed GPIO interface connected to the ARM Cortex-M0+ IO bus with up to 29 General-Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors, programmable open-drain mode, input inverter, and digital filter. GPIO direction control supports independent set/clear/toggle of individual bits.

 High-current source output driver (20 mA) on four pins.

 High-current sink driver (20 mA) on two true open-drain pins.

 GPIO interrupt generation capability with boolean pattern-matching feature on eight GPIO inputs.

 Switch matrix for flexible configuration of each I/O pin function.

 CRC engine.

 DMA with 18 channels and 9 trigger inputs.

lTimers:

 State Configurable Timer (SCTimer/PWM) with input and output functions (including capture and match) for timing and PWM applications. Each SCTimer/PWM input is multiplexed to allow selecting from several input sources such as pins, ADC interrupt, or comparator output.

 Four-channel Multi-Rate Timer (MRT) for repetitive interrupt generation at up to four programmable, fixed rates.

 Self-Wake-up Timer (WKT) clocked from either the IRC, a low-power, low-frequency internal oscillator, or an external clock input in the always-on power domain.

 Windowed Watchdog timer (WWDT).

l Analog peripherals:

 One 12-bit ADC with up to 12 input channels with multiple internal and external trigger inputs and with sample rates of up to 1.2 Msamples/s. The ADC supports two independent conversion sequences.

 Comparator with four input pins and external or internal reference voltage.

l Serial peripherals:

 Three USART interfaces with pin functions assigned through the switch matrix and one common fractional baud rate generator.

 Two SPI controllers with pin functions are assigned through the switch matrix.

 Four I2C-bus interfaces. One I2C supports Fast-mode Plus with 1 Mbit/s data rates on two true open-drain pins and listen mode. Three I2Cs support data rates up to 400 kbit/s on standard digital pins.

l Clock generation:

 12 MHz internal RC oscillator trimmed to 1.5 % accuracy that can optionally be used as a system clock.

 Crystal oscillator with an operating range of 1 MHz to 25 MHz.

 Programmable watchdog oscillator with a frequency range of 9.4 kHz to 2.3 MHz.

 PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the system oscillator, the external clock input, or the internal RC oscillator.

 Clock output function with divider that can reflect all internal clock sources.

l Power control:

 Power consumption in active mode as low as 90 uA/MHz in low-current mode using the IRC as the clock source.

 Integrated PMU (Power Management Unit) to minimize power consumption.

 Reduced power modes: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode.

 Wake-up from Deep-sleep and Power-down modes on activity on USART, SPI, and

I2C peripherals.

 Timer-controlled self wake-up from Deep power-down mode

 Power-On Reset (POR).

 Brownout detects (BOD).

lUnique device serial number for identification.

lSingle power supply (1.8 V to 3.6 V).

lOperating temperature range is -40 °C to +105 °C.

l Available in a TSSOP20 and HVQFN33 (5x5) package.

LPC824M201JHI33E Application

  • Sensor gateways 

  • Simple motor control

  • Industrial 

  • Portables and wearables

  • Gaming controllers 

  • Lighting

  • 8/16-bit applications 

  • Motor control

  • Consumer

  • Fire and security applications

  • Climate control

LPC824M201JHI33E Block Diagram

LPC824M201JHI33E Package

LPC824M201JHI33E Manufacturer

NXP Semiconductors provides mixed signal and standard products based on its security, identification, automotive, networking, radio frequency, analogue signal, and power management expertise.

Datasheet PDF

Download datasheets and manufacturer documentation for NXP USA Inc. LPC824M201JHI33E.

LPC824M201JHI33E Documents

Download datasheets and manufacturer documentation for LPC824M201JHI33E

Datasheets
LPC82x
PCN Design/Specification
Packing Label Chg 28/Dec/2016
Environmental Information
NXP RoHS3 Cert

Frequently Asked Questions

What is the key features of LPC824M201JHI33E?
• System: o ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to 30 MHz with single-cycle multiplier and fast single-cycle I/O port. o ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC). o System tick timer. o AHB multilayer matrix. o Serial Wire Debug (SWD) with four breakpoints and two watchpoints. JTAG boundary-scan (BSDL) supported. o MTB • Memory: o Up to 32 KB on-chip flash programming memory with 64 Byte page write and erase. Code Read Protection (CRP) supported. o 8 KB SRAM. • ROM API support: o Boot loader. o On-chip ROM APIs for ADC, SPI, I2C, USART, power configuration (power profiles) and integer divide. o Flash In-Application Programming (IAP) and In-System Programming (ISP).
What package is LPC824M201JHI33E available in?
It is available in an HVQFN33 (5x5) package.
What is the operating temperature range of LPC824M201JHI33E?
Its operating temperature range is -40 °C to +105 °C.
FAQ
What is the key features of LPC824M201JHI33E?
• System: o ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to 30 MHz with single-cycle multiplier and fast single-cycle I/O port. o ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC). o System tick timer. o AHB multilayer matrix. o Serial Wire Debug (SWD) with four breakpoints and two watchpoints. JTAG boundary-scan (BSDL) supported. o MTB • Memory: o Up to 32 KB on-chip flash programming memory with 64 Byte page write and erase. Code Read Protection (CRP) supported. o 8 KB SRAM. • ROM API support: o Boot loader. o On-chip ROM APIs for ADC, SPI, I2C, USART, power configuration (power profiles) and integer divide. o Flash In-Application Programming (IAP) and In-System Programming (ISP).
What package is LPC824M201JHI33E available in?
It is available in an HVQFN33 (5x5) package.
What is the operating temperature range of LPC824M201JHI33E?
Its operating temperature range is -40 °C to +105 °C.

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