LTST-C191KRKT SMD LED: Circuit, Pinout, and Datasheet

The LTST-C191KRKT is a Red 1.6 x 0.8 x 1.1 mm 130° Water Clear 54 mcd 2 V SMD LED Chip. For automated PC board assembly and space-sensitive applications, Lite-On offers SMD LED bulbs in microscopic sizes and unique configurations. These SMD LED lamps can be used in a wide range of electronic products.

The following figure is LTST-C191KRKT Schematic.

Schematic

The followings are LTST-C191KRKT Symbol, Footprint and 3D Model.

* Meet ROHS, Green Product.

* Super Thin (0.55H mm) Chip LED.

* Ultra Bright AlInGaP Chip LED.

* Package In 8mm Tape On 13" Diameter Reels.

*  EIA  STD Package.

* I.C. Compatible.

* Compatible With Automatic Placement Equipment.

* Compatible With Infrared Reflow Solder Process.

Lite-On Inc. LTST-C191KRKT technical specifications, attributes, parameters and parts with similar specifications to Lite-On Inc. LTST-C191KRKT.

The following shows how to Make ESP32 Breakout Board with LTST-C191KRKT.

Circuit

A current-operated device is an LED. A current limiting resistor should be included in the drive circuit, in series with each LED, to ensure intensity uniformity on several LEDs connected in parallel in an application, as shown in the design below.

Drive Circuit

(A) Circuit that should be used.

(B) Due to changes in the I-V characteristics of the LEDs, the brightness of each LED may appear to be different.

• Ordinary Electronic Equipment (Such As Office Equipment, Communication Equipment and Household Applications)

• Aviation

• Transportation

• Traffic Control Equipment

• Medical and Life Support Systems

• Safety Devices

The following figure shows LTST-C191KRKT Package.

Package

The LEDs should be stored in an environment with a maximum temperature of 30°C and relative humidity of 60%. LEDs should be IR-reflowed within 672 hours after being removed from their original packing (MSL 2a).

The LEDs should be stored in a sealed container with adequate desiccant or in desiccators with a nitrogen atmosphere for lengthy storage outside of their original packing.

LEDs that have been out of their original packaging for more than 672 hours should be baked for at least 20 hours at 60 degrees Celsius before soldering.

The LED will be damaged by static electricity or a power surge.

Suggestions for avoiding ESD damage include:

1. When handling these LEDs, wear a conductive wrist band or an anti-electrostatic glove.

2. Proper grounding is required for all devices, equipment, and machinery.

3. Work tables, storage racks, and other similar items should be grounded properly.

4. Use an ion blower to remove any static charge that may have accumulated on the surface of the LED's plastic lens due to friction between LEDs during storage and handling.

At low currents, ESD-damaged LEDs will exhibit aberrant features such as a high reverse leakage current, low forward voltage, or " no lightup ".

Check for " lightup " and Vf of the problem LEDs at low currents to rule out ESD damage.

InGaN LEDs should have a Vf of >2.0V@0.1mA, while  AlInGaP  LEDs should have a Vf of >1.4V@0.1mA.

Lite-On began manufacturing LED bulbs in 1975 and has since grown to become one of the world's largest optoelectronics companies, offering customers both visible and infrared product solutions. Lite-success On's has been attributed to high volume capacities for commodity items and application-specific products, as well as strong R&D and vertical integration.