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HomeCommunitySubjectMK64FN1M0VLQ12 NXP semiconductor 144LQFP: MK64FN1M0VLQ12 VS ATSAM4E16EA-AUR, Datasheet, Pinout

MK64FN1M0VLQ12 NXP semiconductor 144LQFP: MK64FN1M0VLQ12 VS ATSAM4E16EA-AUR, Datasheet, Pinout

Embedded - Microcontrollers A/D 41x16b; D/A 2x12b 144-LQFP DMA, I2S, LVD, POR, PWM, WDT -40°C~105°C TA 1.71V~3.6V Kinetis K60 MICROCONTROLLER, RISC IC MCU 32BIT 1MB FLASH 144LQFP

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Dec 4, 2021

Berg Rossetti

Sell MK64FN1M0VLQ12 of NXP Semiconductors

 

Embedded - Microcontrollers A/D 41x16b; D/A 2x12b 144-LQFP DMA, I2S, LVD, POR, PWM, WDT -40°C~105°C TA 1.71V~3.6V Kinetis K60 MICROCONTROLLER, RISC IC MCU 32BIT 1MB FLASH 144LQFP

MK64FN1M0VLQ12 is an NXP semiconductor, which has many features such as Ultra-Low-Power , Flash, SRAM, and FlexMemory. This article is going to introduce pinout, features, Comparison between MK64FN1M0VLQ12 and ATSAM4E16EA-AUR, and more detailed information about MK64FN1M0VLQ12.

MK64FN1M0VLQ12

100In Stock
Min.: 1 Mult.: 1
Quantity Unit Price Ext. Price
1+ $17.18143$17.18
10+ $16.20889$162.09
100+ $15.29141$1529.14
500+ $14.42586$7212.93
1000+ $13.6093$13609.3
Unit Price:$17.18143
Subtotal: $17.18
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Overview of MK64FN1M0VLQ12

The MK64FN1M0VLQ12 is optimized for cost-sensitive applications requiring low-power, USB/Ethernet connectivity, and up to 256 KB of embedded SRAM. The device shares the comprehensive enablement and scalability of the Kinetis family.

MK64FN1M0VLQ12 Features

Ultra-Low-Power

  • Flexible low-power modes with power and clock gating for optimal peripheral activity and recovery times.

  • Full memory and analog operation down to 1.71 volts for extended battery life.

  • Low-leakage wake-up unit with up to seven internal modules and 16 pins as wake-up sources in low-leakage stop (LLS)/very low-leakage stop (VLLS) modes.

  • Low-power timer for continual system operation in reduced power state.

 

Flash, SRAM, and FlexMemory

  • Up to 1 MB flash. Fast access, high reliability with four-level security protection.

  • 256 KB of SRAM

  • FlexMemory: Up to 4 KB of the user-segmentable byte write/erase EEPROM for data tables/system data. EEPROM with over 10M cycles and flash with 70 µsec write time (brownouts without data loss/corruption). No user or system intervention to complete programming and erase functions and full operation down to 1.71 volts. In addition, up to 128KB of FlexNVM for extra program code, data, or EEPROM backup.

 

Mixed-Signal Capability

  • Two high-speed, 16-bit analog-to-digital converters (ADCs) with configurable resolution. Single or differential output mode operation for improved noise rejection. 500 ns conversion time achievable with programmable delay block triggering.

  • Two 12-bit digital-to-analog converters (DACs) for analog waveform generation for audio applications.

  • Three high-speed comparators provide fast and accurate motor over-current protection by driving PWMs to a safe state.

  • Analog voltage reference provides an accurate reference to analog blocks, ADC and DAC, and replaces external voltage references to reduce system cost.

 

Performance

  • ARM Cortex-M4 core + DSP. 120 MHz, single-cycle MAC, single instruction multiple data (SIMD) extensions, single-precision floating-point unit.

  • Up to 16-channel DMA for peripheral and memory servicing with reduced CPU loading and faster system throughput.

  • Crossbar switch enables concurrent multi-master bus accesses, increasing bus bandwidth

  • Independent flash banks allow concurrent code execution and firmware updating with no performance degradation or complex coding routines.

 

Timing and Control

  • Up to four FlexTimers with a total of 20 channels. Hardware dead-time insertion and quadrature decoding for motor control.

  • Carrier modulator timer for infrared waveform generation in remote control applications.

  • A four-channel 32-bit periodic interrupt timer provides a time base for RTOS task scheduler or trigger source for ADC conversion and programmable delay block.

 

 Human-Machine Interface (HMI)

  • GPIO with pin interrupt support

 

Connectivity and Communications

  • IEEE 1588 Ethernet MAC with hardware time stamping provides precision clock synchronization for real-time industrial control.

  • USB 2.0 On-The-Go (full-speed) with USB transceiver. Intelligent design with embedded 48 MHz oscillators allowing for USB crystal-less system design. Device charge detect optimizes charging current/time for portable USB devices enabling longer battery life. Low-voltage regulator supplies up to 120 mA off-chip at 3.3 volts to power external components from 5 volts input.

  • Up to six UARTs with IrDA support including one UART with ISO7816 smart card support. Variety of data size, format, and transmission/reception settings supported for multiple industrial communication protocols.

  • Inter-IC Sound (I2S) serial interface for audio system interfacing.

  • CAN module for industrial network bridging.

  • Three DSPI and three I2C.

Specifications

NXP USA Inc. MK64FN1M0VLQ12 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK64FN1M0VLQ12.

MK64FN1M0VLQ12 Tech Specifications

NXP USA Inc. MK64FN1M0VLQ12 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK64FN1M0VLQ12.

Product Attribute Attribute Value
Factory Lead Time13 Weeks
Mounting TypeSurface Mount
Package / Case144-LQFP
Surface MountYES
Data ConvertersA/D 41x16b; D/A 2x12b
Number of I/Os100I/Os
Operating Temperature-40°C~105°C TA
PackagingTray
SeriesKinetis K60
Published2012
Part StatusActive
Moisture Sensitivity Level (MSL)3 (168 Hours)
Number of Terminations144Terminations
ECCN Code3A991.A.2
HTS Code8542.31.00.01
Product Attribute Attribute Value
Terminal PositionQUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel)NOT SPECIFIED
Supply Voltage3.3V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
JESD-30 CodeS-PQFP-G144
Supply Voltage-Max (Vsup)3.6V
Supply Voltage-Min (Vsup)1.71V
Oscillator TypeInternal
Speed120MHz
RAM Size256K x 8
Voltage - Supply (Vcc/Vdd)1.71V~3.6V
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
Core ProcessorARM® Cortex®-M4
Product Attribute Attribute Value
PeripheralsDMA, I2S, LVD, POR, PWM, WDT
Clock Frequency50MHz
Program Memory TypeFLASH
Core Size32-Bit
Program Memory Size1MB 1M x 8
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Has ADCYES
DMA ChannelsYES
PWM ChannelsYES
DAC ChannelsYES
Length20mm
Width20mm
RoHS StatusROHS3 Compliant
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MK64FN1M0VLQ12 Pinout

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MK64FN1M0VLQ12 Symbol

 

MK64FN1M0VLQ12 Footprint

 

MK64FN1M0VLQ12 3D Model

MK64FN1M0VLQ12 VS ATSAM4E16EA-AUR

  ATSAM4E16EA-AUR MK64FN1M0VLQ12
Factory Lead Time 10 Weeks 13 Weeks
Operating Temperature -40°C~85°C TA -40°C~105°C TA
Packaging Tape & Reel (TR) Tray
Series SAM4E Kinetis K60
Supply Voltage 1.2V 3.3V
Supply Voltage-Max  1.32V 3.6V
Supply Voltage-Min  1.08V 1.71V
Number of I/O 117 100
RAM Size 128K x 8 256K x 8

MK64FN1M0VLQ12 Manufacturer

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy, and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Freescale Semiconductor has been acquired by NXP Semiconductor. Freescale Semiconductor parts are now a part of the NXP family (Dec 2015).

Frequently Asked Questions

How many pins of MK64FN1M0VLQ12 ?
144 pins.
What’s the operating temperature of MK64FN1M0VLQ12?
-40°C~105°C TA
FAQ
How many pins of MK64FN1M0VLQ12 ?
144 pins.
What’s the operating temperature of MK64FN1M0VLQ12?
-40°C~105°C TA

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