TPS1H100AQPWPRQ1 High-Side Power Switch: Features, Pinout, and Datasheet

The TPS1H100AQPWPRQ1 is a fully protected high-side power switch with an integrated NMOS power FET and charge pump that is designed to intelligently regulate a variety of resistive, inductive, and capacitive loads. It stands out from the competition because of its accurate current sense and programmable current limit capabilities.

It has a single channel and is fully protected. The load may be intelligently controlled thanks to full diagnostics and high-accuracy current-sense features. The overall system's reliability is considerably improved by a programmable current-limit function. When diagnostics are disabled, both versions of the device diagnostic reporting can be set to the high-impedance state for multiplexing the MCU analog or digital interface among devices, and both can be set to the high-impedance state when diagnostics are removed.

The open-drain structure is used for version A of the digital status report. It pulls down to GND when a fault condition arises. To match the microcontroller supply level, a 3.3- or 5-V external pull-up is necessary.

High-accuracy current sensing in version B enables for a stronger real-time monitoring effect and more accurate diagnostics without the need for additional calibration. A current mirror is used to supply 1 / K of the load current, which is reflected on the CS pin as voltage. K remains constant regardless of temperature or supply voltage. The current-sensing function functions normally throughout a broad linear range of 0 to 4 V. By bringing up the voltage of VCS,h, the CS pin can also notify a defect.

For smart high-side power-switch devices, short-circuit reliability is crucial. The purpose of the AEC-Q100-012 standard is to verify the device's reliability when operating in a continuous short-circuit scenario. According to the past cycles, different grade levels are assigned. This device has the highest degree of qualification, Grade A, with a 1 million times short-to-GND certification.

Low-wattage bulbs, LEDs, relays, solenoids, and heaters can all benefit from the TPS1H100AQPWPRQ1 device, which can be utilized as a high-side power switch for a range of resistive, inductive, and capacitive loads.

The following figure is TPS1H100AQPWPRQ1 Pinout.

Pinout

The TPS1H100AQPWPRQ1 CAD Model is shown as follows.

Symbol

Footprint

3D Model

• Qualified for automotive applications

• AEC-Q100 Qualified with the following results:

– Device temperature grade 1: –40°C to 125°C ambient operating temperature range

– Device HBM ESD classification level H3A

– Device CDM ESD classification level C4B

• Functional safety capable

– Documentation available to aid functional safety system design

• Single-channel smart high-side power switch with full diagnostics

– Version A: open-drain status output

– Version B: current sense analog output

• Wide operating voltage 3.5 to 40 V • Very-low standby current, <0.5 µA

• Operating junction temperature, –40 to 150°C • Input control, 3.3-V and 5-V logic compatible

• High-accuracy current sense, ±30 mA at 1 A, ±4 mA at 5 mA

• Programmable current limit with external resistor, ±20% at 0.5 A

• Diagnostic enable function for multiplexing of mcu analog or digital interface

• Tested according to AECQ100-12 Grade A, 1 million times Short to GND test

• Electrical transient disturbance immunity certification of ISO7637-2 and ISO16750-2

• Protection

– Overload and short-circuit protection

– Inductive load negative voltage clamp

– Undervoltage lockout ( UVLO ) protection

– Thermal shutdown/swing with self recovery

– Loss of GND, loss of supply protection

– Reverse battery protection with external circuitry

• Diagnostic

– On- and Off-state output open- and short-tobattery detection

– Overload and short to ground detection and current limit

– Thermal shutdown/swing detection

• 14-Pin Thermally-enhanced PWP package

The following figure is TPS1H100AQPWPRQ1 Functional Block Diagram.

Functional Block Diagram

The following figure is TPS1H100AQPWPRQ1 Typical Application Schematic.

Typical Application Schematic

The following figure shows an example of how to design the external circuitry parameters.

Typical Application Circuitry

Design Requirements

• VS range from 9 V to 16 V

• Nominal current of 2 A

• Current sense for fault monitoring

• Expected current limit value of 5 A

• Full diagnostics with 5-V MCU

• Reverse protection with GND network

TJ must be less than 150°C to avoid a thermal shutdown. The power dissipation may be significant if the output current is quite high. The thermal impedance of the HTSSOP package is excellent. The  PCB  layout, on the other hand, is critical. A good PCB design can improve heat transfer, which is critical for the device's long-term durability.

• Increase the heat conductivity of the board by increasing the copper covering on the PCB. The copper on the PCB is the primary heatflow channel from the package to the ambient. When there are no heat sinks attached to the PCB on the opposite side of the board from the package, maximum copper is critical.

• To improve the board's thermal conductivity, place as many thermal vias as feasible directly beneath the package ground pad.

• To avoid solder voids, all thermal vias should be plated shut or plugged and sealed on both sides of the board. Solder coverage should be at least 85% to assure reliability and performance.

Without a GND Network

Without a GND network, tie the thermal pad directly to the board GND copper for better thermal performance.

Layout Without a GND Network

With a GND Network

With a GND network, tie the thermal pad with a single trace through the GND network to the board GND copper.

Layout With a GND Network

• High-side power switch for sub-module

• Power switch for low-wattage lamp

• High-side relays and solenoids

• PLC Digital output power switch

• General resistive, inductive, and capacitive loads

The TPS1H100AQPWPRQ1 Package is shown as follows.

Package

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one of the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus.