TPS1H100BQPWPRQ1 High-Side Power Switch: Layout, Pinout, and Datasheet

The TPS1H100BQPWPRQ1 is a high-side power switch with an integrated NMOS power FET and charge pump. It has a single channel and is fully protected. The load may be intelligently controlled thanks to full diagnostics and high-accuracy current-sense features. The overall system's reliability is considerably improved by a programmable current-limit function. When diagnostics are disabled, both versions of the device diagnostic reporting can be set to the high-impedance state for multiplexing the MCU analog or digital interface among devices, and both can be set to the high-impedance state when diagnostics are removed.

The open-drain structure is used for version A of the digital status report. It pulls down to GND when a fault condition arises. To match the microcontroller supply level, a 3.3- or 5-V external pullup is necessary. High-accuracy current sensing in version B enables for a stronger real-time monitoring effect and more accurate diagnostics without the need for additional calibration. A current mirror is used to supply 1 / K of the load current, which is reflected on the CS pin as voltage. K remains constant regardless of temperature or supply voltage. The current-sensing function functions normally throughout a broad linear range of 0 to 4 V. By bringing up the voltage of VCS,h, the CS pin can also notify a defect.

The external high-accuracy current limit allows the application to set the current limit value. It greatly enhances system reliability by effectively clamping inrush current during start-up or short-circuit scenarios. It can also lower system costs by lowering PCB trace, connector size, and power-stage capacity. This gadget also includes an inbuilt current limit. The external or internal current-limit value with the lowest value is used.

Low-wattage bulbs, LEDs, relays, solenoids, and heaters can all benefit from the TPS1H100BQPWPRQ1 device, which can be utilized as a high-side power switch for a range of resistive, inductive, and capacitive loads.

The TPS1H100BQPWPRQ1 Pinout is shown as follows.

Pinout

The TPS1H100BQPWPRQ1 Symbol, Footprint and 3D Model are shown as follows.

Symbol

Footprint

3D Model

• Qualified for automotive applications

• AEC-Q100 Qualified with the following results:

– Device temperature grade 1: –40°C to 125°C ambient operating temperature range 

– Device HBM ESD classification level H3A

– Device CDM ESD classification level C4B

• Functional safety capable

– Documentation available to aid functional safety system design

• Single-channel smart high-side power switch with full diagnostics

– Version A: open-drain status output

– Version B: current sense analog output 

• Wide operating voltage 3.5 to 40 V • Very-low standby current, <0.5 µA • Operating junction temperature, –40 to 150°C • Input control, 3.3-V and 5-V logic compatible

• High-accuracy current sense, ±30 mA at 1 A, ±4 mA at 5 mA

• Programmable current limit with external resistor, ±20% at 0.5 A • Diagnostic enable function for multiplexing of MCU analog or digital interface

• Tested according to AECQ100-12 Grade A, 1 million times Short to GND test

• Electrical transient disturbance immunity certification of ISO7637-2 and ISO16750-2

• Protection

– Overload and short-circuit protection

– Inductive load negative voltage clamp

– Undervoltage lockout ( UVLO ) protection

– Thermal shutdown/swing with self recovery

– Loss of GND, loss of supply protection 

– Reverse battery protection with external circuitry

• Diagnostic

– On- and Off-state output open- and short-tobattery detection

– Overload and short to ground detection and current limit

– Thermal shutdown/swing detection

• 14-Pin Thermally-enhanced PWP package

The TPS1H100BQPWPRQ1 Functional Block Diagram is shown as follows.

Functional Block Diagram

The TPS1H100BQPWPRQ1 Typical Application Schematic is shown as follows.

Typical Application Schematic

TJ must be less than 150°C to avoid thermal shutdown. The power dissipation may be significant if the output current is quite high. The thermal impedance of the HTSSOP package is excellent. The  PCB  layout, on the other hand, is critical. A good PCB design can improve heat transfer, which is critical for the device's long-term durability.

• Increase the heat conductivity of the board by increasing the copper covering on the PCB. The copper on the PCB is the primary heatflow channel from the package to the ambient. When there are no heat sinks attached to the PCB on the opposite side of the board from the package, maximum copper is critical.

• To improve the board's thermal conductivity, place as many thermal vias as feasible directly beneath the package ground pad.

• To avoid solder voids, all thermal vias should be plated shut or plugged and sealed on both sides of the board. Solder coverage should be at least 85% to assure reliability and performance.

1. Without a GND Network

If you don't have a GND network, connect the thermal pad to the board's GND copper directly for improved thermal performance.

Layout Without a GND Network

2. With a GND Network

Connect the thermal pad to the board's GND copper via a single trace through the GND network.

Layout With a GND Network

• High-side power switch for sub-module

• Power switch for low-wattage lamp

• High-side relays and solenoids

• PLC Digital output power switch

• General resistive, inductive, and capacitive loads

The TPS1H100BQPWPRQ1 Package is shown as follows.

Package

Texas Instruments Incorporated (TI) is an American technology corporation based in Dallas, Texas, that creates and manufactures semiconductors and integrated circuits for electronic designers and manufacturers around the world. Based on sales volume, it is one of the top ten semiconductor businesses in the world. Analog chips and embedded processors, which account for more than 80% of the company's revenue, are the company's main focus. TI also makes calculators, microcontrollers, and multi-core processors, as well as TI digital light processing technologies and education technology. As of 2016, the corporation had 45,000 patents worldwide.