Embedded - Microcontrollers - Application Specific
158 Products Found Manufacturers: AMD
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AMD(158)
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| Part # | Manufacturer | Pricing | Quantity | Availability | Surface Mount | Number of Terminals | Ihs Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Series | JESD-609 Code | Terminal Finish | Additional Feature | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Original | Min.: 1 Mult.: 1 | - | - | - | Advanced Micro Devices | - | - | - | Bulk | - | - | - | - | - | - | - | Active | - | - | - | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | - | 125 °C | -40 °C | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | No | - | - | - | - | e0 | Tin/Lead (Sn/Pb) | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | Not Qualified | AUTOMOTIVE | PROGRAMMABLE SoC | 3.44 mm | - | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 1924 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1924 | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1924 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 45 mm | 45 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 1517 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1517 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | - | - | PLASTIC/EPOXY | BGA | FLIPCHIP-484 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | - | compliant | 30 | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | - | - | - | - | |||
| Original | Min.: 1 Mult.: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.742 V | 0.698 V | 0.72 V | - | e1 | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | - | - | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||
| Original | Min.: 1 Mult.: 1 | YES | 1760 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1760 | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1760 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | |||
