All ProductsIntegrated Circuits (ICs)Embedded - Microcontrollers - Application Specific

Embedded - Microcontrollers - Application Specific

Integrated Circuits (ICs) are electronic components that contain a large number of interconnected electronic devices, such as transistors, resistors, and capacitors, on a single chip. These devices are fabricated using semiconductor materials, typically silicon, and are used to perform various functions in electronic systems. Embedded ICs, also known as microcontrollers, are a type of IC that are designed to be embedded into a larger electronic system. They are often used to control and monitor the operation of the system, performing tasks such as data processing, communication, and interfacing with other devices. Microcontrollers are commonly found in a wide range of applications, including consumer electronics, automotive systems, industrial automation, and medical devices. Application-specific ICs (ASICs) are a specialized type of IC that are designed for a specific application or function. Unlike general-purpose microcontrollers, ASICs are tailored to meet the specific requirements of a particular application, resulting in improved performance, lower power consumption, and reduced cost. They are commonly used in applications where high performance and efficiency are critical, such as telecommunications, networking, and signal processing. The combination of embedded microcontrollers and application-specific ICs allows for the development of highly optimized and efficient electronic systems. These ICs enable the integration of complex functionality into a single chip, reducing the size, cost, and power consumption of the overall system. They also provide a high level of flexibility and customization, allowing designers to create tailored solutions for specific applications. Overall, integrated circuits - embedded microcontrollers - application-specific ICs play a crucial role in modern electronic systems, providing the necessary intelligence and functionality to enable a wide range of applications and technologies.

51 Products Found Manufacturers: Xilinx

FILTERS remaining

Part #

Manufacturers
RESET

Xilinx(51)

HTS Code
RESET

Ihs Manufacturer
RESET

JESD-30 Code
RESET

Number of Terminals
RESET

Package Body Material
RESET

Package Code
RESET

Package Description
RESET

Package Shape
RESET

Package Style
RESET

Part Life Cycle Code
RESET

Reach Compliance Code
RESET

Rohs Code
RESET

Surface Mount
RESET

Terminal Form
RESET

Terminal Position
RESET

uPs/uCs/Peripheral ICs Type
RESET

Length
RESET

Operating Temperature-Max
RESET

Seated Height-Max
RESET

Part #	Manufacturer	Availability	Surface Mount	Number of Terminals	Date Of Intro	Ihs Manufacturer	Moisture Sensitivity Levels	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Qualification Status	Temperature Grade	uPs/uCs/Peripheral ICs Type	Seated Height-Max	Bus Compatibility	Length	Width
XCZU9CG-2SBVA484I Microprocessor Circuit, CMOS, PBGA484, BGA-484	AMD Xilinx	Min.: 1 Mult.: 1	YES	484	-	XILINX INC	-	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA484,22X22,32	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	-	-	8542.31.00.01	BOTTOM	BALL	-	0.8 mm	unknown	-	S-PBGA-B484	-	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU9CG-2SBVA484I AMD Xilinx - In Stock: -
XCZU9CG-2SFVC784I Description: Microprocessor Circuit, CMOS, PBGA784, BGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	-	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA78428X28,32	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU9CG-2SFVC784I AMD Xilinx - In Stock: -
XCZU9CG-1SBVA484I Microprocessor Circuit, CMOS, PBGA484, BGA-484	AMD Xilinx	Min.: 1 Mult.: 1	YES	484	-	XILINX INC	-	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA484,22X22,32	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	-	-	8542.31.00.01	BOTTOM	BALL	-	0.8 mm	unknown	-	S-PBGA-B484	-	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU9CG-1SBVA484I AMD Xilinx - In Stock: -
XCZU9CG-L1SFVC784I Microprocessor Circuit, CMOS, PBGA784, BGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	-	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA78428X28,32	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.742 V	0.698 V	0.72 V	-	TIN SILVER COPPER	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU9CG-L1SFVC784I AMD Xilinx - In Stock: -
XCZU19EG-3FFVE1924I Description: Microprocessor Circuit, CMOS, PBGA1924, FCBGA-1924	AMD Xilinx	Min.: 1 Mult.: 1	YES	1924	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1924	-	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	-	45 mm	45 mm
XCZU19EG-3FFVE1924I AMD Xilinx - In Stock: -
XCZU9CG-2SBVA484E Microprocessor Circuit, CMOS, PBGA484, BGA-484	AMD Xilinx	Min.: 1 Mult.: 1	YES	484	-	XILINX INC	-	100 °C	-	PLASTIC/EPOXY	FBGA	FBGA, BGA484,22X22,32	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	-	-	8542.31.00.01	BOTTOM	BALL	-	0.8 mm	unknown	-	S-PBGA-B484	-	OTHER	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU9CG-2SBVA484E AMD Xilinx - In Stock: -
XQ7Z030-2RF900I Microprocessor Circuit, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, BGA-900	AMD Xilinx	Min.: 1 Mult.: 1	YES	900	-	XILINX INC	-	-	-	PLASTIC/EPOXY	BGA	31 X 31 MM, 1 MM PITCH, BGA-900	BGA900,30X30,40	SQUARE	GRID ARRAY	Transferred	No	-	-	-	e0	TIN LEAD	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	not_compliant	-	S-PBGA-B900	Not Qualified	-	PROGRAMMABLE SoC	3.44 mm	-	31 mm	31 mm
XQ7Z030-2RF900I AMD Xilinx - In Stock: -
XQ7Z030-1RF900I Microprocessor Circuit, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, BGA-900	AMD Xilinx	Min.: 1 Mult.: 1	YES	900	-	XILINX INC	-	-	-	PLASTIC/EPOXY	BGA	31 X 31 MM, 1 MM PITCH, BGA-900	BGA900,30X30,40	SQUARE	GRID ARRAY	Transferred	No	-	-	-	e0	TIN LEAD	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	not_compliant	-	S-PBGA-B900	Not Qualified	-	PROGRAMMABLE SoC	3.44 mm	-	31 mm	31 mm
XQ7Z030-1RF900I AMD Xilinx - In Stock: -
XCZU6CG-2SBVA484E Description: Microprocessor Circuit, CMOS, PBGA484, BGA-484	AMD Xilinx	Min.: 1 Mult.: 1	YES	484	-	XILINX INC	-	100 °C	-	PLASTIC/EPOXY	FBGA	FBGA, BGA484,22X22,32	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	-	-	8542.31.00.01	BOTTOM	BALL	-	0.8 mm	unknown	-	S-PBGA-B484	-	OTHER	PROGRAMMABLE SoC	2.61 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	19 mm	19 mm
XCZU6CG-2SBVA484E AMD Xilinx - In Stock: -
XCZU4EV-3SFVC784I Description: Microprocessor Circuit, CMOS, PBGA784, FCBGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA,	-	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	-	23 mm	23 mm
XCZU4EV-3SFVC784I AMD Xilinx - In Stock: -
XCZU7EV-3FBVB900I Microprocessor Circuit, CMOS, PBGA900, FCBGA-900	AMD Xilinx	Min.: 1 Mult.: 1	YES	900	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	-	INDUSTRIAL	PROGRAMMABLE SoC	2.97 mm	-	31 mm	31 mm
XCZU7EV-3FBVB900I AMD Xilinx - In Stock: -
XCZU3EG-3SFVA625E Microprocessor Circuit, CMOS, PBGA625, FLIPCHIP-625	AMD Xilinx	Min.: 1 Mult.: 1	YES	625	-	XILINX INC	4	100 °C	-	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	-	-	compliant	-	S-PBGA-B625	-	OTHER	PROGRAMMABLE SoC	-	-	-	-
XCZU3EG-3SFVA625E AMD Xilinx - In Stock: -
XCZU11EG-3FFVF1517I Description: Microprocessor Circuit, CMOS, PBGA1517, FCBGA-1517	AMD Xilinx	Min.: 1 Mult.: 1	YES	1517	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1517	-	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	-	40 mm	40 mm
XCZU11EG-3FFVF1517I AMD Xilinx - In Stock: -
XCZU6EG-3FFVB1156I Description: Microprocessor Circuit, CMOS, PBGA1156, FCBGA-1156	AMD Xilinx	Min.: 1 Mult.: 1	YES	1156	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1156	-	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	-	35 mm	35 mm
XCZU6EG-3FFVB1156I AMD Xilinx - In Stock: -
XCZU11EG-3FFVB1517I Description: Microprocessor Circuit, CMOS, PBGA1517, FCBGA-1517	AMD Xilinx	Min.: 1 Mult.: 1	YES	1517	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Transferred	Yes	-	-	0.9 V	e1	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	compliant	-	S-PBGA-B1517	-	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	-	40 mm	40 mm
XCZU11EG-3FFVB1517I AMD Xilinx - In Stock: -
XCZU9CG-L1SFVA625I Microprocessor Circuit, CMOS, PBGA625, BGA-625	AMD Xilinx	Min.: 1 Mult.: 1	YES	625	-	XILINX INC	-	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA625,25X25,32	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.742 V	0.698 V	0.72 V	-	-	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	-	0.8 mm	unknown	-	S-PBGA-B625	-	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU9CG-L1SFVA625I AMD Xilinx - In Stock: -
XCZU6CG-1FBVB900I Microprocessor Circuit, CMOS, PBGA900, BGA-900	AMD Xilinx	Min.: 1 Mult.: 1	YES	900	-	XILINX INC	-	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA, BGA900,30X30,40	BGA900,30X30,40	SQUARE	GRID ARRAY	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	-	-	8542.31.00.01	BOTTOM	BALL	-	1 mm	unknown	-	S-PBGA-B900	-	INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	31 mm	31 mm
XCZU6CG-1FBVB900I AMD Xilinx - In Stock: -
XCZU6CG-1SFVC784I Microprocessor Circuit, CMOS, PBGA784, BGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	-	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA78428X28,32	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.876 V	0.825 V	0.85 V	-	TIN SILVER COPPER	-	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU6CG-1SFVC784I AMD Xilinx - In Stock: -
XCZU6CG-L1SFVC784I Description: Microprocessor Circuit, CMOS, PBGA784, BGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	-	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA, BGA78428X28,32	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	0.742 V	0.698 V	0.72 V	-	TIN SILVER COPPER	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	23 mm	23 mm
XCZU6CG-L1SFVC784I AMD Xilinx - In Stock: -
XCZU5EV-3SFVC784I Microprocessor Circuit, CMOS, PBGA784, FCBGA-784	AMD Xilinx	Min.: 1 Mult.: 1	YES	784	2017-02-15	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	FBGA,	-	SQUARE	GRID ARRAY, FINE PITCH	Transferred	Yes	-	-	0.9 V	e1	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	-	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	-	23 mm	23 mm
XCZU5EV-3SFVC784I AMD Xilinx - In Stock: -

1 2 3

Popular Suppliers

Index: #0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Embedded - Microcontrollers - Application Specific

FILTERS remaining

Manufacturers RESET

HTS Code RESET

Ihs Manufacturer RESET

JESD-30 Code RESET

Number of Terminals RESET

Package Body Material RESET

Package Code RESET

Package Description RESET

Package Shape RESET

Package Style RESET

Part Life Cycle Code RESET

Reach Compliance Code RESET

Rohs Code RESET

Surface Mount RESET

Terminal Form RESET

Terminal Position RESET

uPs/uCs/Peripheral ICs Type RESET

Length RESET

Operating Temperature-Max RESET

Seated Height-Max RESET