USB Flash Drives
1,612 Products Found
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Part Status
Chip Density (bit)
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Timing Type
Automotive
PPAP
Typical Operating Supply Voltage (V)
Maximum Operating Supply Voltage (V)
Minimum Operating Supply Voltage (V)
Programmability
ECCN (US)
Command Compatible
Support of Page Mode
ECC Support
Boot Block
Cell Type
Architecture
Maximum Operating Temperature (°C)
| Part # | Manufacturer | Pricing | Quantity | Availability | Address Bus Width (bit) | Automotive | Block Organization | Cell Type | Chip Density (bit) | Command Compatible | ECC Support | ECCN (US) | EU RoHS | HTS | Interface Type | Lead Shape | Location of Boot Block | Max. Access Time (ns) | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Maximum Page Access Time (ns) | Maximum Programming Time (ms) | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | Operating Current (mA) | Package Height | Package Length | Package Width | Page Read Current (mA) | PCB changed | PPAP | Program Current (mA) | Programmability | Programmable | Programming Voltage (V) | RoHS | Standard Package Name | Supplier Package | Supplier Temperature Grade | Support of Page Mode | SVHC | Timing Type | Typical Operating Supply Voltage (V) | Packaging | Part Status | Pin Count | Architecture | Sector Size | Page Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Samsung Semiconductor | Min.: 1 Mult.: 1 | - | - | - | - | - | - | - | - | Supplier Unconfirmed | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 32 | No | Symmetrical | SLC NAND | 1G | Yes | Yes | 3A991.b.1.a | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | 7 | 0.01/Block | 104 | 3.6 | 85 | - | 0.7/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 128M | 35 | 2.31 | 10.31 | 7.49 | - | 16 | No | 35 | Yes | - | 2.7 to 3.6 | - | SOP | SOIC W | Industrial | Yes | Yes | Synchronous | 3|3.3 | Tray | Active | 16 | Sectored | 128Kbyte x 1024 | 2Kbyte | No | |||
| Western Digital | Min.: 1 Mult.: 1 | - | - | - | - | - | - | - | - | Not Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | |||
| Western Digital | Min.: 1 Mult.: 1 | - | - | - | - | - | - | - | - | Not Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | - | - | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | - | No | Symmetrical | NAND|NOR | 1G NAND+16M NOR | - | Yes | EAR99 | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | - | - | - | 3.6 | 85 | - | - | - | 2.7 | -40 | Surface Mount | - | - | 2 | - | 6 | 8 | - | 8 | No | - | Yes | - | 2.7 to 3.6 | - | - | WSON | Industrial | No | - | Synchronous | 3|3.3 | - | Active | 8 | Sectored | - | - | - | |||
| Samsung Semiconductor | Min.: 1 Mult.: 1 | - | No | - | - | 1T | - | - | - | Supplier Unconfirmed | - | Serial e-MMC | - | - | - | - | - | 1.95|3.6 | - | - | - | - | 1.7|2.7 | - | - | - | - | - | 1.2 | 13 | 11.5 | - | - | No | - | - | - | - | - | - | - | - | - | - | Synchronous | 1.8|3.3 | - | Obsolete | - | - | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 24 | No | Symmetrical | NOR | 512K | Yes | No | EAR99 | Compliant | - | Serial (SPI, Dual SPI) | Gull-wing | Top|Bottom | 8 | 2/Chip | - | 3.6 | 85 | - | 0.8/Page | - | 2.3 | -40 | Surface Mount | 8 | 64K | 14 | 1.5(Max) | 5(Max) | 4(Max) | - | 8 | No | 12 | Yes | - | 2.3 to 3.6 | - | SOP | SOIC | Industrial | No | - | Synchronous | 3.3|2.5 | - | Active | 8 | Sectored | 4Kbyte x 16 | 256byte | Yes | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 24 | No | Symmetrical | NOR | 2M | Yes | No | EAR99 | Compliant | - | Serial (SPI, Dual SPI) | - | Bottom|Top | 8 | 2/Chip | - | 3.6 | 85 | - | 0.8/Page | - | 2.3 | -40 | Surface Mount | 8 | 256K | 14 | 0.8 | 4.9 | 3.9 | - | 8 | No | 12 | Yes | - | 2.3 to 3.6 | - | SOP | VSOP | Industrial | No | - | Synchronous | 2.5|3|3.3 | - | Active | 8 | Sectored | 4Kbyte x 64 | 256byte | Yes | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | - | Yes | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | Unconfirmed | - | - | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 32 | No | Symmetrical | NOR | 256M | Yes | No | 3A991.b.1.a | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | 6 | 400/Chip | 133 | 1.95 | 85 | - | 5/Page | 100000 | 1.7 | -40 | - | 8 | 32M | 20 | - | - | - | - | - | No | 20 | Yes | - | 1.7 to 1.95 | - | - | - | Industrial | No | - | Synchronous | 1.8 | - | Active | - | Sectored | 4Kbyte x 8192 | 256byte | No | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 24 | No | Symmetrical | NOR | 32M | Yes | No | 3A991.b.1.a | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | - | Bottom|Top | 6 | 50/Chip | - | 3.6 | 85 | - | 3/Page | 100000 | 2.7 | -40 | Through Hole | 8 | 4M | 25 | 3.3 | 9.27 | 6.35 | - | 8 | No | 25 | Yes | - | 2.7 to 3.6 | - | - | PDIP | Industrial | No | - | Synchronous | 3|3.3 | Tube | Obsolete | 8 | Sectored | 4Kbyte x 1024 | 256byte | Yes | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | - | Yes | - | - | - | - | - | - | Compliant | 8542.32.00.71 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | Unconfirmed | - | - | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 24 | No | Symmetrical | NOR | 64M | Yes | No | 3A991.b.1.a | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | Bottom|Top | 6 | 100/Chip | - | 1.95 | 85 | - | 5/Page | 100000 | 1.65 | -40 | Surface Mount | 8 | 8M | 20 | 1.8 | 5.28 | 5.28 | - | 8 | No | 25 | Yes | - | 1.65 to 1.95 | - | SOP | SOIC W | Industrial | No | - | Synchronous | 1.8 | Tube | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | Yes | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 32 | No | Symmetrical | SLC NAND | 2G | Yes | Yes | 3A991.b.1.a | Compliant | - | Serial (SPI, Dual SPI, Quad SPI) | Ball | - | 7 | 0.01/Block | - | 3.6 | 85 | - | 0.7/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 256M | 35 | 0.85 | 8 | 6 | - | 24 | No | 35 | Yes | - | 2.7 to 3.6 | - | BGA | TFBGA | Industrial | No | - | Synchronous | 3|3.3 | Tray | Obsolete | 24 | Sectored | - | - | No | |||
| Samsung Semiconductor | Min.: 1 Mult.: 1 | - | No | - | - | 32G | - | - | - | Compliant | 8542.32.00.51 | Serial e-MMC | - | - | - | - | - | 1.95|3.6 | - | - | - | - | 1.7|2.7 | - | - | - | - | - | 0.8 | 11 | 10 | - | - | No | - | - | - | - | - | - | - | - | - | - | Synchronous | 1.8|3.3 | - | Unconfirmed | - | Sectored | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | - | Yes | - | - | - | - | - | - | Compliant | 8542.32.00.71 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | Unconfirmed | - | - | - | - | - | |||
| Samsung Semiconductor | Min.: 1 Mult.: 1 | - | No | Symmetrical | - | 16G | - | - | - | Compliant | 8542.32.00.71 | Parallel | - | - | - | - | - | 3.6 | - | - | - | - | 2.7 | - | Surface Mount | - | - | - | 1 | 12 | 18.4 | - | 48 | No | - | - | - | - | - | - | TSOP-I | - | - | - | Asynchronous | 3.3 | - | Obsolete | 48 | Sectored | - | - | - | |||
| Winbond Electronics Corporation | Min.: 1 Mult.: 1 | 24 | No | Symmetrical | NOR | 1M | Yes | No | EAR99 | Compliant | - | Serial (SPI, Dual SPI) | Gull-wing | - | 8 | 1/Chip | 104 | 3.6 | 85 | - | 0.8/Page | 100000 | 2.3 | -40 | Surface Mount | 8 | 128K | 14 | 1.5(Max) | 5(Max) | 4(Max) | - | 8 | No | 15 | Yes | Yes | 2.3 to 3.6 | - | SOP | SOIC N | Industrial | No | - | Synchronous | 2.5|3.3 | Tube | NRND | 8 | Sectored | 4Kbyte x 32 | 256byte | No | |||
| Samsung Semiconductor | Min.: 1 Mult.: 1 | 26 | No | Symmetrical | NAND | 512M | No | Yes | 3A991.b.1.a | Compliant | - | Parallel | Gull-wing | - | - | 0.003/Block | - | 3.6 | 125 | 42(Min) | 0.5 | 100000 | 2.7 | -10 | Surface Mount | 8 | 64M | 20 | 1 | 12 | 18.4 | 20 | 48 | No | 20 | Yes | - | - | - | SOP | TSOP-I | Commercial | Yes | - | Asynchronous | 3.3 | Tape and Reel | Obsolete | 48 | Sectored | - | 512byte | No | |||
| Samsung Semiconductor | Min.: 1 Mult.: 1 | - | No | Symmetrical | - | 512M | - | - | - | Compliant | 8542.32.00.71 | Parallel | - | - | - | - | - | 3.6 | - | - | - | - | 2.7 | - | Surface Mount | - | - | - | 1 | 12 | 18.4 | - | 48 | No | - | - | - | - | Compliant | - | TSOP-I | - | - | - | Asynchronous | 3.3 | - | Obsolete | 48 | Sectored | - | - | - | |||
