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10AS032H2F34E1SG vs 10AS066K4F35I3SGES

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Mfr. Part #	10AS032H2F34E1SG	10AS066K4F35I3SGES
Manufacturer	ALTERA	ALTERA
Description	IC SOC FPGA 384 I/O 1152FBGA	IC SOC FPGA 396 I/O 1152FBGA
Datasheet
RoHS
Specifications
Package / Case	1152-BBGA, FCBGA	1152-BBGA, FCBGA
Surface Mount	YES	YES
Supplier Device Package	1152-FBGA (35x35)	1152-FBGA (35x35)
Number of Terminals	1152	1152
Package	Bulk	Tape & Reel (TR)
Base Product Number	YAFD54	-
Mfr	TE Connectivity Deutsch Connectors	Knowles Syfer
Product Status	Active	Active
Number of I/Os	384	396
Package Description	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	BGA,
Package Style	GRID ARRAY	GRID ARRAY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA1152,34X34,40	-
Supply Voltage-Nom	0.9 V	0.9 V
Reflow Temperature-Max (s)	NOT SPECIFIED	-
Supply Voltage-Min	0.87 V	0.87 V
Operating Temperature-Max	100 °C	100 °C
Rohs Code	Yes	-
Manufacturer Part Number	10AS032H2F34E1SG	10AS066K4F35I3SGES
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Manufacturer	Intel Corporation	Intel Corporation
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEL CORP	INTEL CORP
Supply Voltage-Max	0.93 V	0.93 V
Risk Rank	5.66	5.66
Series	*	*
Operating Temperature	0°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Packaging	Tray	Tray
Part Status	Discontinued at Digi-Key	Discontinued at Digi-Key
HTS Code	8542.39.00.01	8542.39.00.01
Subcategory	Field Programmable Gate Arrays	-
Technology	CMOS	-
Terminal Position	BOTTOM	BOTTOM
Terminal Form	BALL	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED	-
Terminal Pitch	1 mm	1 mm
Reach Compliance Code	compliant	compliant
JESD-30 Code	S-PBGA-B1152	S-PBGA-B1152
Number of Outputs	384	-
Qualification Status	Not Qualified	-
Power Supplies	0.9 V	-
Temperature Grade	OTHER	INDUSTRIAL
Speed	1.5GHz	1.5GHz
RAM Size	256KB	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA, POR, WDT	DMA, POR, WDT
Connectivity	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA	MCU, FPGA
Number of Inputs	384	-
Seated Height-Max	3.65 mm	3.5 mm
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes	FPGA - 320K Logic Elements	FPGA - 660K Logic Elements
Number of Logic Cells	320000	-
Flash Size	--	--
Width	35 mm	35 mm
Length	35 mm	35 mm
Operating Temperature-Min	-	-40 °C
Pricing(USD)
Grads Price	-	-
Availability	-	-
Price	-	-
Quantity

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10AS032H2F34E1SG vs 10AS066K4F35I3SGES

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