| Mfr. Part # | A42MX16-1PLG84M | A42MX36-1BG272M |
| Manufacturer | Microchip Technology | Microchip Technology |
| Description | FPGA - Field Programmable Gate Array A42MX16-1PLG84M LEAD FREE | FPGA - Field Programmable Gate Array A42MX36-1BG272M |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Package / Case | PLCC-84 | BGA-272 |
Mounting Type | Surface Mount | Surface Mount |
Surface Mount | YES | YES |
Supplier Device Package | 84-PLCC (29.31x29.31) | 272-PBGA (27x27) |
Number of Terminals | 84 | 272 |
Shipping Restrictions | This product may require additional documentation to export from the United States. | This product may require additional documentation to export from the United States. |
RoHS | Details | N |
Number of I/Os | 72 I/O | 202 I/O |
Supply Voltage-Min | 3 V | 3 V |
Minimum Operating Temperature | - 55 C | - 55 C |
Maximum Operating Temperature | + 125 C | + 125 C |
Mounting Styles | SMD/SMT | SMD/SMT |
Maximum Operating Frequency | 198 MHz | 151 MHz |
Moisture Sensitive | Yes | Yes |
Factory Pack QuantityFactory Pack Quantity | 16 | 40 |
Tradename | Actel | Actel |
Unit Weight | 0.239083 oz | - |
Supply Voltage-Max | 5.5 V | 5.5 V |
Package | Tray | Tray |
Base Product Number | A42MX16 | A42MX36 |
Mfr | Microchip Technology | Microchip Technology |
Product Status | Active | Active |
Package Description | QCCJ, | PLASTIC, BGA-272 |
Package Style | CHIP CARRIER | GRID ARRAY |
Moisture Sensitivity Levels | 3 | 3 |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Operating Temperature-Min | -55 °C | -55 °C |
Supply Voltage-Nom | 3.3 V | 3.3 V |
Reflow Temperature-Max (s) | 40 | 30 |
Operating Temperature-Max | 125 °C | 125 °C |
Rohs Code | Yes | No |
Manufacturer Part Number | A42MX16-1PLG84M | A42MX36-1BG272M |
Clock Frequency-Max | 108 MHz | 83 MHz |
Package Code | QCCJ | BGA |
Package Shape | SQUARE | SQUARE |
Part Life Cycle Code | Active | Active |
Ihs Manufacturer | MICROSEMI CORP | MICROSEMI CORP |
Risk Rank | 5.28 | 5.19 |
Series | A42MX16 | A42MX36 |
Packaging | Tube | Tray |
Operating Temperature | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) |
JESD-609 Code | e3 | e0 |
ECCN Code | 3A001.A.2.C | 3A001.A.2.C |
Terminal Finish | Matte Tin (Sn) | TIN LEAD SILVER |
Additional Feature | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Technology | CMOS | CMOS |
Voltage - Supply | 3.3 V, 5 V | 3.3 V, 5 V |
Terminal Position | QUAD | BOTTOM |
Terminal Form | J BEND | BALL |
Peak Reflow Temperature (Cel) | 245 | 225 |
Terminal Pitch | 1.27 mm | 1.27 mm |
Reach Compliance Code | compliant | compliant |
JESD-30 Code | S-PQCC-J84 | S-PBGA-B272 |
Qualification Status | Not Qualified | Not Qualified |
Temperature Grade | MILITARY | MILITARY |
Organization | 1232 CLBS, 24000 GATES | 2438 CLBS, 54000 GATES |
Seated Height-Max | 4.572 mm | 2.5 mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Gates | 24000 | 54000 |
Combinatorial Delay of a CLB-Max | 2.4 ns | 2.3 ns |
Number of CLBs | 1232 | 2438 |
Number of Equivalent Gates | 24000 | 54000 |
Height | 3.68 mm | 1.73 mm |
Length | 29.31 mm | 27 mm |
Width | 29.31 mm | 27 mm |
Lifecycle Status | - | Production (Last Updated: 2 months ago) |
Mount | - | Surface Mount |
Number of Pins | - | 272 |
Part Package Code | - | BGA |
Max Operating Temperature | - | 125 °C |
Min Operating Temperature | - | -55 °C |
RAM Size | - | 320 B |
Number of Logic Elements/Cells | - | 1184 |
Total RAM Bits | - | 2560 |
Max Frequency | - | 151 MHz |
Number of Logic Blocks (LABs) | - | 1184 |
Speed Grade | - | 1 |
Number of Registers | - | 1822 |
Voltage - Supply (Max) | - | 5.5 V |
Voltage - Supply (Min) | - | 3 V |
Radiation Hardening | - | No |
| Pricing(USD) | ||
| Grads Price | - | - |
| Availability | - | - |
| Price | - | - |
| Quantity |
In Stock