| Mfr. Part # | A54SX32A-1CQ256M | A42MX36-1BG272M |
| Manufacturer | Microchip Technology | Microchip Technology |
| Description | FPGA - Field Programmable Gate Array A54SX32A-1CQ256M | FPGA - Field Programmable Gate Array A42MX36-1BG272M |
| Datasheet | ||
| RoHS | ||
| Specifications | ||
Package / Case | CQFP-256 | BGA-272 |
Mounting Type | Surface Mount | Surface Mount |
Surface Mount | YES | YES |
Supplier Device Package | 256-CQFP (75x75) | 272-PBGA (27x27) |
Number of Terminals | 256 | 272 |
Shipping Restrictions | This product may require additional documentation to export from the United States. | This product may require additional documentation to export from the United States. |
RoHS | N | N |
Number of I/Os | 249 I/O | 202 I/O |
Supply Voltage-Min | 2.5 V | 3 V |
Minimum Operating Temperature | - 55 C | - 55 C |
Maximum Operating Temperature | + 125 C | + 125 C |
Mounting Styles | SMD/SMT | SMD/SMT |
Maximum Operating Frequency | 278 MHz | 151 MHz |
Factory Pack QuantityFactory Pack Quantity | 1 | 40 |
Tradename | Actel | Actel |
Supply Voltage-Max | 2.5 V | 5.5 V |
Package | Tray | Tray |
Base Product Number | A54SX32 | A42MX36 |
Mfr | Microchip Technology | Microchip Technology |
Product Status | Active | Active |
Package Description | QFF, TPAK256,3SQ,20 | PLASTIC, BGA-272 |
Package Style | FLATPACK | GRID ARRAY |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
Package Equivalence Code | TPAK256,3SQ,20 | - |
Operating Temperature-Min | -55 °C | -55 °C |
Supply Voltage-Nom | 2.5 V | 3.3 V |
Reflow Temperature-Max (s) | 20 | 30 |
Operating Temperature-Max | 125 °C | 125 °C |
Rohs Code | No | No |
Manufacturer Part Number | A54SX32A-1CQ256M | A42MX36-1BG272M |
Clock Frequency-Max | 278 MHz | 83 MHz |
Package Code | QFF | BGA |
Package Shape | SQUARE | SQUARE |
Part Life Cycle Code | Active | Active |
Ihs Manufacturer | MICROSEMI CORP | MICROSEMI CORP |
Risk Rank | 5.24 | 5.19 |
Series | A54SX32A | A42MX36 |
Operating Temperature | -55°C ~ 125°C (TC) | -55°C ~ 125°C (TC) |
JESD-609 Code | e0 | e0 |
ECCN Code | 3A001.A.2.C | 3A001.A.2.C |
Terminal Finish | TIN LEAD | TIN LEAD SILVER |
Additional Feature | 32000 TYPICAL GATES AVAILABLE | ALSO OPERATES AT 5V SUPPLY |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Technology | CMOS | CMOS |
Voltage - Supply | 2.5 V | 3.3 V, 5 V |
Terminal Position | QUAD | BOTTOM |
Terminal Form | FLAT | BALL |
Peak Reflow Temperature (Cel) | 225 | 225 |
Terminal Pitch | 0.5 mm | 1.27 mm |
Reach Compliance Code | unknown | compliant |
JESD-30 Code | S-CQFP-F256 | S-PBGA-B272 |
Number of Outputs | 228 | - |
Qualification Status | Not Qualified | Not Qualified |
Power Supplies | 2.5,3.3/5 V | - |
Temperature Grade | MILITARY | MILITARY |
Number of Inputs | 228 | - |
Organization | 2880 CLBS, 48000 GATES | 2438 CLBS, 54000 GATES |
Seated Height-Max | 3.3 mm | 2.5 mm |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
Number of Gates | 48000 | 54000 |
Number of LABs/CLBs | 2880 | - |
Combinatorial Delay of a CLB-Max | 1.1 ns | 2.3 ns |
Number of CLBs | 2880 | 2438 |
Number of Logic Cells | 2880 | - |
Number of Equivalent Gates | 48000 | 54000 |
Width | 36 mm | 27 mm |
Length | 36 mm | 27 mm |
Lifecycle Status | - | Production (Last Updated: 2 months ago) |
Mount | - | Surface Mount |
Number of Pins | - | 272 |
Moisture Sensitive | - | Yes |
Moisture Sensitivity Levels | - | 3 |
Part Package Code | - | BGA |
Packaging | - | Tray |
Max Operating Temperature | - | 125 °C |
Min Operating Temperature | - | -55 °C |
RAM Size | - | 320 B |
Number of Logic Elements/Cells | - | 1184 |
Total RAM Bits | - | 2560 |
Max Frequency | - | 151 MHz |
Number of Logic Blocks (LABs) | - | 1184 |
Speed Grade | - | 1 |
Number of Registers | - | 1822 |
Voltage - Supply (Max) | - | 5.5 V |
Voltage - Supply (Min) | - | 3 V |
Height | - | 1.73 mm |
Radiation Hardening | - | No |
| Pricing(USD) | ||
| Grads Price | - | - |
| Availability | - | - |
| Price | - | - |
| Quantity |
In Stock