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Mfr. Part # APA300-FG144M

A42MX36-1BG272M

Manufacturer Microchip TechnologyMicrochip Technology
Description

FPGA - Field Programmable Gate Array APA300-FG144M

FPGA - Field Programmable Gate Array A42MX36-1BG272M

Datasheet
RoHS
Specifications

Package / Case

FBGA

BGA-272

Mounting Type

Surface Mount

Surface Mount

Supplier Device Package

144-FPBGA (13x13)

272-PBGA (27x27)

Shipping Restrictions

This product may require additional documentation to export from the United States.

This product may require additional documentation to export from the United States.

RoHS

N

N

Number of I/Os

100 I/O

202 I/O

Supply Voltage-Min

2.3 V

3 V

Minimum Operating Temperature

- 55 C

- 55 C

Maximum Operating Temperature

+ 125 C

+ 125 C

Mounting Styles

SMD/SMT

SMD/SMT

Maximum Operating Frequency

180 MHz

151 MHz

Moisture Sensitive

Yes

Yes

Factory Pack QuantityFactory Pack Quantity

160

40

Tradename

Actel

Actel

Unit Weight

0.014110 oz

-

Package

Tray

Tray

Base Product Number

APA300

A42MX36

Mfr

Microchip Technology

Microchip Technology

Product Status

Active

Active

Supply Voltage-Max

2.7 V

5.5 V

Series

APA300

A42MX36

Packaging

Tray

Tray

Operating Temperature

-55°C ~ 125°C (TC)

-55°C ~ 125°C (TC)

Voltage - Supply

2.5 V

3.3 V, 5 V

Total RAM Bits

73728

2560

Number of Gates

300000

54000

Height

1.05 mm

1.73 mm

Length

13 mm

27 mm

Width

13 mm

27 mm

Lifecycle Status

-

Production (Last Updated: 2 months ago)

Mount

-

Surface Mount

Surface Mount

-

YES

Number of Pins

-

272

Number of Terminals

-

272

Package Description

-

PLASTIC, BGA-272

Package Style

-

GRID ARRAY

Moisture Sensitivity Levels

-

3

Package Body Material

-

PLASTIC/EPOXY

Operating Temperature-Min

-

-55 °C

Supply Voltage-Nom

-

3.3 V

Reflow Temperature-Max (s)

-

30

Operating Temperature-Max

-

125 °C

Rohs Code

-

No

Manufacturer Part Number

-

A42MX36-1BG272M

Clock Frequency-Max

-

83 MHz

Package Code

-

BGA

Package Shape

-

SQUARE

Part Life Cycle Code

-

Active

Ihs Manufacturer

-

MICROSEMI CORP

Risk Rank

-

5.19

Part Package Code

-

BGA

JESD-609 Code

-

e0

ECCN Code

-

3A001.A.2.C

Terminal Finish

-

TIN LEAD SILVER

Max Operating Temperature

-

125 °C

Min Operating Temperature

-

-55 °C

Additional Feature

-

ALSO OPERATES AT 5V SUPPLY

HTS Code

-

8542.39.00.01

Technology

-

CMOS

Terminal Position

-

BOTTOM

Terminal Form

-

BALL

Peak Reflow Temperature (Cel)

-

225

Terminal Pitch

-

1.27 mm

Reach Compliance Code

-

compliant

JESD-30 Code

-

S-PBGA-B272

Qualification Status

-

Not Qualified

Temperature Grade

-

MILITARY

RAM Size

-

320 B

Organization

-

2438 CLBS, 54000 GATES

Seated Height-Max

-

2.5 mm

Programmable Logic Type

-

FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells

-

1184

Max Frequency

-

151 MHz

Number of Logic Blocks (LABs)

-

1184

Speed Grade

-

1

Number of Registers

-

1822

Combinatorial Delay of a CLB-Max

-

2.3 ns

Number of CLBs

-

2438

Voltage - Supply (Max)

-

5.5 V

Voltage - Supply (Min)

-

3 V

Number of Equivalent Gates

-

54000

Radiation Hardening

-

No

Pricing(USD)
Grads Price

Quantity

Unit Price

1+

$732.37592

10+

$690.92068

100+

$651.81196

500+

$614.91694

1000+

$580.11032

-
Availability

505

-

Price

$732.37592

-

Quantity

In Stock : 505