Aries Electronics 24-350000-10 Adapter & Breakout Boards24Positions 2.400Lx0.450W 60.96mmx11.43mm SOIC FR4 Epoxy Glass
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Inquiry
Min.: 1 Mult.: 1
24-350000-10
196-719-24-350000-10
Board Thickness: 0.062 1.57mm 1/16, Number of Positions: 24Positions, Size / Dimension: 2.400Lx0.450W 60.96mmx11.43mm, Package Accepted: SOIC, Material: FR4 Epoxy Glass
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24-350000-10 Tech Specifications
24-350000-10 Tech Specifications
Aries Electronics 24-350000-10 technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 24-350000-10.
| Product Attribute | Attribute Value | |
|---|---|---|
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | SOIC | |
| Contact Materials | Brass | |
| Published | 2010 | |
| Series | Correct-A-Chip® 350000 | |
| Size / Dimension | 2.400Lx0.450W 60.96mmx11.43mm | |
| JESD-609 Code | e0 | |
| Pbfree Code | no |
| Product Attribute | Attribute Value | |
|---|---|---|
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Number of Positions | 24Positions | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 2Rows | |
| Additional Feature | SOCKET ADAPTER | |
| Pitch | 0.050 1.27mm |
| Product Attribute | Attribute Value | |
|---|---|---|
| Number of Contacts | 24Contacts | |
| Row Spacing | 7.62 mm | |
| Device Socket Type | IC SOCKET | |
| Proto Board Type | SMD to DIP | |
| Height | 1.58mm | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Lead Free |
24-350000-10 Documents
24-350000-10 Documents
Download datasheets and manufacturer documentation for 24-350000-10
24-350000-10 Comparison
24-350000-10 Comparison
The parts on the right have similar specifications to Aries Electronics & 24-350000-10.
Mfr. Part #
Manufacturer
Proto Board Type
Moisture Sensitivity Level (MSL)
Number of Positions
Size / Dimension
Package Accepted
Pitch
Series
Material
Board Thickness
Availability
Price
Quantity
24-350000-10
Aries Electronics
SMD to DIP
1 (Unlimited)
24
2.400Lx0.450W 60.96mmx11.43mm
SOIC
0.050 1.27mm
Correct-A-Chip® 350000
FR4 Epoxy Glass
0.062 1.57mm 1/16
-
-
- -
24-350000-11-RC
Aries Electronics
SMD to DIP
1 (Unlimited)
24
2.400Lx0.450W 60.96mmx11.43mm
SOIC
0.050 1.27mm
Correct-A-Chip® 350000
FR4 Epoxy Glass
0.062 1.57mm 1/16
-
-
- -
- 24-350000-10vs24-350000-11-RCvs24-650000-10
24-650000-10
Aries Electronics
SMD to DIP
1 (Unlimited)
24
2.400Lx0.450W 60.96mmx11.43mm
SOIC
0.050 1.27mm
Correct-A-Chip® 350000
FR4 Epoxy Glass
0.062 1.57mm 1/16
-
-
- -
- 24-350000-10vs24-650000-10vs24-350000-11-RC
PA0009
Chip Quik Inc.
SMD to DIP
1 (Unlimited)
24
2.400Lx0.450W 60.96mmx11.43mm
SOIC
0.050 1.27mm
Correct-A-Chip® 350000
FR4 Epoxy Glass
0.062 1.57mm 1/16
-
-
- -
- 24-350000-10vsPA0009vs24-350000-11-RC
PA0010
Chip Quik Inc.
SMD to DIP
1 (Unlimited)
24
2.400Lx0.450W 60.96mmx11.43mm
SOIC
0.050 1.27mm
Correct-A-Chip® 350000
FR4 Epoxy Glass
0.062 1.57mm 1/16
-
-
- -
- 24-350000-10vsPA0010vs24-350000-11-RC