JAK Electronics

Aries Electronics 18-350000-11-RC Adapter & Breakout Boards18Positions 1.800Lx0.450W 45.72mmx11.43mm SOIC FR4 Epoxy Glass

18-350000-11-RC
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18-350000-11-RC
196-719-18-350000-11-RC
Aries Electronics
Board Thickness: 0.062 1.57mm 1/16, Number of Positions: 18Positions, Size / Dimension: 1.800Lx0.450W 45.72mmx11.43mm, Package Accepted: SOIC, Material: FR4 Epoxy Glass
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18-350000-11-RC Tech Specifications

Aries Electronics 18-350000-11-RC technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 18-350000-11-RC.

Product Attribute Attribute Value
Factory Lead Time5 Weeks
Contact PlatingGold
MaterialFR4 Epoxy Glass
Package AcceptedSOIC
Contact MaterialsBrass
SeriesCorrect-A-Chip® 350000
Published2006
Size / Dimension1.800Lx0.450W 45.72mmx11.43mm
JESD-609 Codee4
Pbfree Codeyes
Part StatusActive
Moisture Sensitivity Level (MSL)1 (Unlimited)
TerminationSolder
ECCN CodeEAR99
Number of Positions18Positions
Additional FeatureSOCKET ADAPTER
Pitch0.050 1.27mm
Number of Contacts18Contacts
Row Spacing3.81 mm
Device Socket TypeIC SOCKET
Proto Board TypeSMD to DIP
FeaturesHigh Temperature
Height1.58mm
Board Thickness0.062 1.57mm 1/16
REACH SVHCNo SVHC
RoHS StatusROHS3 Compliant
Lead FreeLead Free
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18-350000-11-RC Documents

Download datasheets and manufacturer documentation for 18-350000-11-RC

18-350000-11-RC Comparison

The parts on the right have similar specifications to Aries Electronics & 18-350000-11-RC.

  • Mfr. Part #

  • Manufacturer

  • Proto Board Type

  • Moisture Sensitivity Level (MSL)

  • Number of Positions

  • Size / Dimension

  • Package Accepted

  • Pitch

  • Series

  • Material

  • Board Thickness

  • Availability

  • Price

  • Quantity

  • 18-350000-11-RC

  • Aries Electronics

  • SMD to DIP

  • 1 (Unlimited)

  • 18

  • 1.800Lx0.450W 45.72mmx11.43mm

  • SOIC

  • 0.050 1.27mm

  • Correct-A-Chip® 350000

  • FR4 Epoxy Glass

  • 0.062 1.57mm 1/16

  • -

  • -

  • -

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