Aries Electronics 16-350000-10-P Adapter & Breakout Boards16Positions 1.600Lx0.450W 40.64mmx11.43mm SOIC FR4 Epoxy Glass
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16-350000-10-P
196-719-16-350000-10-P
Board Thickness: 0.062 1.57mm 1/16, Number of Positions: 16Positions, Size / Dimension: 1.600Lx0.450W 40.64mmx11.43mm, Package Accepted: SOIC, Material: FR4 Epoxy Glass
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16-350000-10-P Tech Specifications
16-350000-10-P Tech Specifications
Aries Electronics 16-350000-10-P technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 16-350000-10-P.
| Product Attribute | Attribute Value | |
|---|---|---|
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Mount | Through Hole | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | SOIC | |
| Series | Correct-A-Chip® 350000 | |
| Published | 2008 | |
| Size / Dimension | 1.600Lx0.450W 40.64mmx11.43mm |
| Product Attribute | Attribute Value | |
|---|---|---|
| JESD-609 Code | e0 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Number of Positions | 16Positions | |
| Pitch | 0.050 1.27mm | |
| Number of Contacts | 16Contacts |
| Product Attribute | Attribute Value | |
|---|---|---|
| Lead Length | 3.175mm | |
| Device Socket Type | IC SOCKET | |
| Proto Board Type | SMD to DIP | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Lead Free |
16-350000-10-P Documents
16-350000-10-P Documents
Download datasheets and manufacturer documentation for 16-350000-10-P
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Best Sales