Aries Electronics 28-650000-10 Adapter & Breakout BoardsFR4 Epoxy Glass 28Positions 2.800Lx0.480W 71.12mmx12.19mm SOIC
Inquiry
Min.: 1 Mult.: 1
28-650000-10
196-719-28-650000-10
DIP
Board Thickness: 0.062 1.57mm 1/16, Material: FR4 Epoxy Glass, Number of Positions: 28Positions, Size / Dimension: 2.800Lx0.480W 71.12mmx12.19mm, Package Accepted: SOIC
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28-650000-10 Tech Specifications
28-650000-10 Tech Specifications
Aries Electronics 28-650000-10 technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 28-650000-10.
| Product Attribute | Attribute Value | |
|---|---|---|
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Package / Case | DIP | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | SOIC | |
| Contact Materials | Brass | |
| Series | Correct-A-Chip® 650000 | |
| Published | 2010 | |
| Size / Dimension | 2.800Lx0.480W 71.12mmx12.19mm | |
| JESD-609 Code | e0 |
| Product Attribute | Attribute Value | |
|---|---|---|
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Number of Positions | 28Positions | |
| Max Operating Temperature | 105°C | |
| Min Operating Temperature | -55°C | |
| Number of Rows | 2Rows | |
| Additional Feature | SOCKET ADAPTER | |
| Pitch | 0.050 1.27mm |
| Product Attribute | Attribute Value | |
|---|---|---|
| Number of Contacts | 28Contacts | |
| Row Spacing | 15.24 mm | |
| Device Socket Type | IC SOCKET | |
| Proto Board Type | SMD to DIP | |
| Height | 1.58mm | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
28-650000-10 Documents
28-650000-10 Documents
Download datasheets and manufacturer documentation for 28-650000-10
28-650000-10 Comparison
28-650000-10 Comparison
The parts on the right have similar specifications to Aries Electronics & 28-650000-10.
Mfr. Part #
Manufacturer
Proto Board Type
Moisture Sensitivity Level (MSL)
Number of Positions
Size / Dimension
Package Accepted
Pitch
Series
Material
Board Thickness
Package / Case
Availability
Price
Quantity
28-650000-10
Aries Electronics
SMD to DIP
1 (Unlimited)
28
2.800Lx0.480W 71.12mmx12.19mm
SOIC
0.050 1.27mm
Correct-A-Chip® 650000
FR4 Epoxy Glass
0.062 1.57mm 1/16
DIP
-
-
- -
28-350002-10
Aries Electronics
SMD to DIP
1 (Unlimited)
28
2.800Lx0.480W 71.12mmx12.19mm
SOIC
0.050 1.27mm
Correct-A-Chip® 650000
FR4 Epoxy Glass
0.062 1.57mm 1/16
DIP
-
-
- -
- 28-650000-10vs28-350002-10vs28-35W000-10
28-35W000-10
Aries Electronics
SMD to DIP
1 (Unlimited)
28
2.800Lx0.480W 71.12mmx12.19mm
SOIC
0.050 1.27mm
Correct-A-Chip® 650000
FR4 Epoxy Glass
0.062 1.57mm 1/16
DIP
-
-
- -
- 28-650000-10vs28-35W000-10vs28-350002-10
IPC0185
Chip Quik Inc.
SMD to DIP
1 (Unlimited)
28
2.800Lx0.480W 71.12mmx12.19mm
SOIC
0.050 1.27mm
Correct-A-Chip® 650000
FR4 Epoxy Glass
0.062 1.57mm 1/16
DIP
-
-
- -
- 28-650000-10vsIPC0185vs28-350002-10
LCQT-SOIC28
Aries Electronics
SMD to DIP
1 (Unlimited)
28
2.800Lx0.480W 71.12mmx12.19mm
SOIC
0.050 1.27mm
Correct-A-Chip® 650000
FR4 Epoxy Glass
0.062 1.57mm 1/16
DIP
-
-
- -
- 28-650000-10vsLCQT-SOIC28vs28-350002-10
