Aries Electronics 1109814 Adapter & Breakout BoardsFR4 Epoxy Glass 8Positions 0.375Dia 9.53mm SOIC
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1109814
196-719-1109814
Board Thickness: 0.062 1.57mm 1/16, Material: FR4 Epoxy Glass, Number of Positions: 8Positions, Size / Dimension: 0.375Dia 9.53mm, Package Accepted: SOIC
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1109814 Tech Specifications
1109814 Tech Specifications
Aries Electronics 1109814 technical specifications, attributes, parameters and parts with similar specifications to Aries Electronics 1109814.
| Product Attribute | Attribute Value | |
|---|---|---|
| Factory Lead Time | 6 Weeks | |
| Mount | Through Hole | |
| Material | FR4 Epoxy Glass | |
| Package Accepted | SOIC | |
| Contact Finish Mating | TIN (200)/TIN LEAD OVER NICKEL | |
| Packaging | Box | |
| Series | Correct-A-Chip® 1109814 | |
| Published | 2009 |
| Product Attribute | Attribute Value | |
|---|---|---|
| Size / Dimension | 0.375Dia 9.53mm | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| ECCN Code | EAR99 | |
| Number of Positions | 8Positions | |
| Additional Feature | ADAPTER |
| Product Attribute | Attribute Value | |
|---|---|---|
| Number of Contacts | 8Contacts | |
| Lead Length | 3.175mm | |
| Device Socket Type | IC SOCKET | |
| Proto Board Type | SMD to DIP | |
| Board Thickness | 0.062 1.57mm 1/16 | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Lead Free |
1109814 Documents
1109814 Documents
Download datasheets and manufacturer documentation for 1109814
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