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All ArticlesLatest BlogLatest NewsLatest SolutionLatest SubjectCambridge Spin-Out Doubles Office Space to Deliver Efficient GaN SolutionsNews Sep 30, 2022 Cambridge GaN Devices (CGD) doubles the size of its prior facilities relocating to St John’s Innovation Park1200V Rating Achieved on Vertical GaN Power DevicesNews Sep 30, 2022 Odyssey Semiconductor Technologies has announced that it has achieved the stated goal of 1200V rating on vertical GaN power field-effect transistors (FETs)Single-stage flyback controller for battery charging applications offers scalable designsNews Sep 30, 2022 Infineon extends its offering of AC-DC controller ICs by introducing a new single-stage PWM controller for flyback topologiesonsemi Expands its Silicon Carbide Fab in the Czech RepublicNews Sep 30, 2022 onsemi has announced the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech RepublicHighly integrated PFC boost converters eliminate startup-circuit design challengesNews Sep 30, 2022 STMicroelectronics has introduced two PFC boost converters with integrated high-voltage startup capability, simplifying design and saving auxiliary circuitryChipletz Chooses Xpeedic’s Metis EM Simulation ToolNews Sep 30, 2022 Metis EM Simulation tool meets unique signal and power integrity analysis challengesSemiconductor Capillary Underfill for Advanced Silicon Node Flip Chip ApplicationsNews Sep 30, 2022 Henkel has released its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.EPC Opens New Motor Drive Center of ExcellenceNews Sep 30, 2022 EPC has opened a new design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets.Contactless SiC Plasma Epi-prep aims to supersede CMP processNews Sep 30, 2022 Oxford Instruments announces the introduction of a SiC substrate contactless plasma polishing system providing a replacement for the chemical mechanical planarization (CMP) method.New insulated CAN measurement module captures up to 1500 VNews Sep 17, 2022 imc Test & Measurement announces a new highly insulated CAN measurement module which meets the demand of the EV and battery testing marketsemiconductor Capillary Underfill for Advanced Silicon Node Flip Chip ApplicationsNews Sep 17, 2022 Henkel has released its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications.Nuclear fusion reaction lasted for 30 seconds at temperature above 100 million °CNews Sep 17, 2022 An experiment run at Seoul National University in South Korea has simultaneously achieved heat and stability levels close to a viable fusion reactor 1 234...10
